Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8723322 | Method of metal sputtering for integrated circuit metal routing | Chien-Kang Chou, Ching-San Lin | 2014-05-13 |
| 6802945 | Method of metal sputtering for integrated circuit metal routing | Chien-Kang Chou, Ching-San Lin | 2004-10-12 |
| 6583039 | Method of forming a bump on a copper pad | Yen-Ming Chen, Kuo-Wei Lin, Cheng-Yu Chu, Yang-Tung Fan, Fu-Jier Fan +2 more | 2003-06-24 |
| 6083790 | Method for making y-shaped multi-fin stacked capacitors for dynamic random access memory cells | Yo-Sheng Lin | 2000-07-04 |
| 5180689 | Tapered opening sidewall with multi-step etching process | Jin-Yuan Lee, Jiann-Kwang Wang, Chue-San Yoo, Pei-Jan Wang | 1993-01-19 |