Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8753978 | Metal and silicon containing capping layers for interconnects | Gengwei Jiang, Pramod Subramonium, Roey Shaviv, Hui-Jung Wu, Nagraj Shankar | 2014-06-17 |
| 8268722 | Interfacial capping layers for interconnects | Hui-Jung Wu, Girish Dixit, Bart J. van Schravendijk, Pramod Subramonium, Gengwei Jiang +2 more | 2012-09-18 |
| 7482245 | Stress profile modulation in STI gap fill | Chi-I Lang, Judy H. Huang | 2009-01-27 |
| 7163896 | Biased H2 etch process in deposition-etch-deposition gap fill | Wenxian Zhu, Siswanto Sutanto, Pingsheng Sun, Jeffrey Chih-Hou Lowe, Waikit Fung +1 more | 2007-01-16 |
| 6822333 | Methods of filling constrained spaces with insulating materials and/or of forming contact holes and/or contacts in an integrated circuit | — | 2004-11-23 |
| 6764952 | Systems and methods to retard copper diffusion and improve film adhesion for a dielectric barrier on copper | Ka Shun Wong, Sanjeev Kumar Jain, Somnath Nag, Haiying Fu, Atul Gupta +1 more | 2004-07-20 |
| 6303496 | Methods of filling constrained spaces with insulating materials and/or of forming contact holes and/or contacts in an integrated circuit | — | 2001-10-16 |