W. Eric Boyd — 20 Patents at Isc8

W. Eric Boyd has been granted 20 US patents while listed as an inventor at Isc8. The first was granted in 2007 and the most recent in August 2017. W. Eric Boyd ranks #214,803 of 4,157,543 US inventors in our database (top 5.2%). Patent records list W. Eric Boyd in Lemon Grove, CA, US.

Issued Patents All Time

Showing 1–20 of 20 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9741680	Wire bond through-via structure and method	Randy Bindrup, John Leon, James Yamaguchi, Angel Pepe	2017-08-22
9728507	Cap chip and reroute layer for stacked microelectronic module	Sambo He	2017-08-08
9431275	Wire bond through-via structure and method	Randy Bindrup, John Leon, James Yamaguchi, Angel Pepe	2016-08-30
9046322	Self-calibrating targeting sight	James Justice	2015-06-02
8835218	Stackable layer containing ball grid array package	Keith Gann	2014-09-16
8637985	Anti-tamper wrapper interconnect method and a device	Randy Bindrup, James Yamaguchi	2014-01-28
8637140	Method for defining an electrically conductive metal structure on a three-dimensional element and a device made from the method	James Yamaguchi	2014-01-28
8609473	Method for fabricating a neo-layer using stud bumped bare die	Peter Lieu, James Yamaguchi, Randy Bindrup	2013-12-17
8586407	Method for depackaging prepackaged integrated circuit die and a product from the method	Peter Lieu	2013-11-19
8415819	Energy harvesting buoy	Itzhak Sapir	2013-04-09
RE43877	Method for precision integrated circuit die singulation using differential etch rates	David Ludwig, James Yamaguchi, Stewart Clark	2012-12-25
8271262	Portable lip reading sensor system	Ying Hsu, Virgilio Villacorta	2012-09-18
7982300	Stackable layer containing ball grid array package	Keith Gann	2011-07-19
7902879	Field programmable gate array utilizing dedicated memory stacks in a vertical layer format	Volkan Ozguz, Randolph S. Carlson, Keith Gann, John Leon	2011-03-08
7786562	Stackable semiconductor chip layer comprising prefabricated trench interconnect vias	Volkan Ozguz, Angel Pepe, James Yamaguchi, Douglas Albert, Andrew Camien	2010-08-31
7777321	Stacked microelectronic layer and module with three-axis channel T-connects	Keith Gann	2010-08-17
7714426	Ball grid array package format layers and structure	Keith Gann	2010-05-11
7649386	Field programmable gate array utilizing dedicated memory stacks in a vertical layer format	Volkan Ozguz, Randolph S. Carlson, Keith Gann, John Leon	2010-01-19
7335576	Method for precision integrated circuit die singulation using differential etch rates	Ludwig David, James Yamaguchi, Stuart Clark	2008-02-26	$294,000
7235785	Imaging device with multiple fields of view incorporating memory-based temperature compensation of an uncooled focal plane array	Bert Hornback, Doug Harwood, Randy Carlson	2007-06-26	$1,372,000

W. Eric Boyd — 20 Patents

Issued Patents All Time

Patent Widget