| 9741680 |
Wire bond through-via structure and method |
Randy Bindrup, John Leon, James Yamaguchi, Angel Pepe |
2017-08-22 |
| 9728507 |
Cap chip and reroute layer for stacked microelectronic module |
Sambo He |
2017-08-08 |
| 9431275 |
Wire bond through-via structure and method |
Randy Bindrup, John Leon, James Yamaguchi, Angel Pepe |
2016-08-30 |
| 9046322 |
Self-calibrating targeting sight |
James Justice |
2015-06-02 |
| 8835218 |
Stackable layer containing ball grid array package |
Keith Gann |
2014-09-16 |
| 8637985 |
Anti-tamper wrapper interconnect method and a device |
Randy Bindrup, James Yamaguchi |
2014-01-28 |
| 8637140 |
Method for defining an electrically conductive metal structure on a three-dimensional element and a device made from the method |
James Yamaguchi |
2014-01-28 |
| 8609473 |
Method for fabricating a neo-layer using stud bumped bare die |
Peter Lieu, James Yamaguchi, Randy Bindrup |
2013-12-17 |
| 8586407 |
Method for depackaging prepackaged integrated circuit die and a product from the method |
Peter Lieu |
2013-11-19 |
| 8415819 |
Energy harvesting buoy |
Itzhak Sapir |
2013-04-09 |
| RE43877 |
Method for precision integrated circuit die singulation using differential etch rates |
David Ludwig, James Yamaguchi, Stewart Clark |
2012-12-25 |
| 8271262 |
Portable lip reading sensor system |
Ying Hsu, Virgilio Villacorta |
2012-09-18 |
| 7982300 |
Stackable layer containing ball grid array package |
Keith Gann |
2011-07-19 |
| 7902879 |
Field programmable gate array utilizing dedicated memory stacks in a vertical layer format |
Volkan Ozguz, Randolph S. Carlson, Keith Gann, John Leon |
2011-03-08 |
| 7786562 |
Stackable semiconductor chip layer comprising prefabricated trench interconnect vias |
Volkan Ozguz, Angel Pepe, James Yamaguchi, Douglas Albert, Andrew Camien |
2010-08-31 |
| 7777321 |
Stacked microelectronic layer and module with three-axis channel T-connects |
Keith Gann |
2010-08-17 |
| 7714426 |
Ball grid array package format layers and structure |
Keith Gann |
2010-05-11 |
| 7649386 |
Field programmable gate array utilizing dedicated memory stacks in a vertical layer format |
Volkan Ozguz, Randolph S. Carlson, Keith Gann, John Leon |
2010-01-19 |
| 7335576 |
Method for precision integrated circuit die singulation using differential etch rates |
Ludwig David, James Yamaguchi, Stuart Clark |
2008-02-26 |
| 7235785 |
Imaging device with multiple fields of view incorporating memory-based temperature compensation of an uncooled focal plane array |
Bert Hornback, Doug Harwood, Randy Carlson |
2007-06-26 |