Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741680 | Wire bond through-via structure and method | Randy Bindrup, W. Eric Boyd, James Yamaguchi, Angel Pepe | 2017-08-22 |
| 9431275 | Wire bond through-via structure and method | Randy Bindrup, W. Eric Boyd, James Yamaguchi, Angel Pepe | 2016-08-30 |
| 8074082 | Anti-tamper module | Volkan Ozguz | 2011-12-06 |
| 7902879 | Field programmable gate array utilizing dedicated memory stacks in a vertical layer format | Volkan Ozguz, Randolph S. Carlson, Keith Gann, W. Eric Boyd | 2011-03-08 |
| 7649386 | Field programmable gate array utilizing dedicated memory stacks in a vertical layer format | Volkan Ozguz, Randolph S. Carlson, Keith Gann, W. Eric Boyd | 2010-01-19 |
| 7265579 | Field programmable gate array incorporating dedicated memory stacks | Randolph S. Carlson, Volkan Ozguz, Keith Gann | 2007-09-04 |
| 6856167 | Field programmable gate array with a variably wide word width memory | Volkan Ozguz, Randolph S. Carlson, Keith Gann | 2005-02-15 |