Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8835218 | Stackable layer containing ball grid array package | W. Eric Boyd | 2014-09-16 |
| 8012803 | Vertically stacked pre-packaged integrated circuit chips | Douglas Albert | 2011-09-06 |
| 7982300 | Stackable layer containing ball grid array package | W. Eric Boyd | 2011-07-19 |
| 7902879 | Field programmable gate array utilizing dedicated memory stacks in a vertical layer format | Volkan Ozguz, Randolph S. Carlson, John Leon, W. Eric Boyd | 2011-03-08 |
| 7872339 | Vertically stacked pre-packaged integrated circuit chips | Douglas Albert | 2011-01-18 |
| 7777321 | Stacked microelectronic layer and module with three-axis channel T-connects | W. Eric Boyd | 2010-08-17 |
| 7714426 | Ball grid array package format layers and structure | W. Eric Boyd | 2010-05-11 |
| 7649386 | Field programmable gate array utilizing dedicated memory stacks in a vertical layer format | Volkan Ozguz, Randolph S. Carlson, John Leon, W. Eric Boyd | 2010-01-19 |
| 7265579 | Field programmable gate array incorporating dedicated memory stacks | Randolph S. Carlson, Volkan Ozguz, John Leon | 2007-09-04 |
| 7174627 | Method of fabricating known good dies from packaged integrated circuits | — | 2007-02-13 |
| 6856167 | Field programmable gate array with a variably wide word width memory | Volkan Ozguz, Randolph S. Carlson, John Leon | 2005-02-15 |
| 6806559 | Method and apparatus for connecting vertically stacked integrated circuit chips | Douglas Albert | 2004-10-19 |
| 6706971 | Stackable microcircuit layer formed from a plastic encapsulated microcircuit | Douglas Albert | 2004-03-16 |