Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8510244 | Apparatus comprising artificial neuronal assembly | John C. Carson | 2013-08-13 |
| 8074082 | Anti-tamper module | John Leon | 2011-12-06 |
| 7919844 | Tier structure with tier frame having a feedthrough structure | Jonathan Stern | 2011-04-05 |
| 7902879 | Field programmable gate array utilizing dedicated memory stacks in a vertical layer format | Randolph S. Carlson, Keith Gann, John Leon, W. Eric Boyd | 2011-03-08 |
| 7786562 | Stackable semiconductor chip layer comprising prefabricated trench interconnect vias | Angel Pepe, James Yamaguchi, W. Eric Boyd, Douglas Albert, Andrew Camien | 2010-08-31 |
| 7768113 | Stackable tier structure comprising prefabricated high density feedthrough | Jonathan Stern | 2010-08-03 |
| 7649386 | Field programmable gate array utilizing dedicated memory stacks in a vertical layer format | Randolph S. Carlson, Keith Gann, John Leon, W. Eric Boyd | 2010-01-19 |
| 7440449 | High speed switching module comprised of stacked layers incorporating t-connect structures | John C. Carson | 2008-10-21 |
| 7265579 | Field programmable gate array incorporating dedicated memory stacks | Randolph S. Carlson, Keith Gann, John Leon | 2007-09-04 |
| 7127807 | Process of manufacturing multilayer modules | James Yamaguchi, Angel Pepe, Andrew Camien | 2006-10-31 |
| 6856167 | Field programmable gate array with a variably wide word width memory | Randolph S. Carlson, Keith Gann, John Leon | 2005-02-15 |
| 6829237 | High speed multi-stage switching network formed from stacked switching layers | John C. Carson | 2004-12-07 |
| 6734370 | Multilayer modules with flexible substrates | James Yamaguchi, Angel Pepe, Andrew Camien | 2004-05-11 |
| 6717061 | Stacking of multilayer modules | James Yamaguchi, Angel Pepe, Andrew Camien | 2004-04-06 |
| 6560109 | Stack of multilayer modules with heat-focusing metal layer | James Yamaguchi, Angel Pepe, Andrew Camien | 2003-05-06 |
| 6117704 | Stackable layers containing encapsulated chips | James Yamaguchi, Andrew Camien | 2000-09-12 |
| 5242707 | System and method for producing electro-optic components integrable with silicon-on-sapphire circuits | Sadik C. Esener, Sing H. Lee, Subramania Krishnakumar, Chi-Yuan Fan | 1993-09-07 |