Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741680 | Wire bond through-via structure and method | Randy Bindrup, W. Eric Boyd, John Leon, Angel Pepe | 2017-08-22 |
| 9431275 | Wire bond through-via structure and method | Randy Bindrup, W. Eric Boyd, John Leon, Angel Pepe | 2016-08-30 |
| 8637140 | Method for defining an electrically conductive metal structure on a three-dimensional element and a device made from the method | W. Eric Boyd | 2014-01-28 |
| 8637985 | Anti-tamper wrapper interconnect method and a device | Randy Bindrup, W. Eric Boyd | 2014-01-28 |
| 8609473 | Method for fabricating a neo-layer using stud bumped bare die | Peter Lieu, Randy Bindrup, W. Eric Boyd | 2013-12-17 |
| RE43877 | Method for precision integrated circuit die singulation using differential etch rates | David Ludwig, Stewart Clark, W. Eric Boyd | 2012-12-25 |
| 7786562 | Stackable semiconductor chip layer comprising prefabricated trench interconnect vias | Volkan Ozguz, Angel Pepe, W. Eric Boyd, Douglas Albert, Andrew Camien | 2010-08-31 |
| 7335576 | Method for precision integrated circuit die singulation using differential etch rates | Ludwig David, Stuart Clark, W. Eric Boyd | 2008-02-26 |
| 7239012 | Three-dimensional module comprised of layers containing IC chips with overlying interconnect layers | Angel Pepe | 2007-07-03 |
| 7127807 | Process of manufacturing multilayer modules | Angel Pepe, Volkan Ozguz, Andrew Camien | 2006-10-31 |
| 6797537 | Method of making stackable layers containing encapsulated integrated circuit chips with one or more overlaying interconnect layers | Angel Pepe | 2004-09-28 |
| 6784547 | Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers | Angel Pepe | 2004-08-31 |
| 6734370 | Multilayer modules with flexible substrates | Angel Pepe, Volkan Ozguz, Andrew Camien | 2004-05-11 |
| 6717061 | Stacking of multilayer modules | Angel Pepe, Volkan Ozguz, Andrew Camien | 2004-04-06 |
| 6560109 | Stack of multilayer modules with heat-focusing metal layer | Angel Pepe, Volkan Ozguz, Andrew Camien | 2003-05-06 |
| 6117704 | Stackable layers containing encapsulated chips | Volkan Ozguz, Andrew Camien | 2000-09-12 |
| 6072234 | Stack of equal layer neo-chips containing encapsulated IC chips of different sizes | Andrew Camien | 2000-06-06 |
| 5953588 | Stackable layers containing encapsulated IC chips | Andrew Camien | 1999-09-14 |
| 5123164 | Hermetic organic/inorganic interconnection substrate for hybrid circuit manufacture | Joseph M. Shaheen | 1992-06-23 |
| 5030499 | Hermetic organic/inorganic interconnection substrate for hybrid circuit manufacture | Joseph M. Shaheen | 1991-07-09 |