| 9741680 |
Wire bond through-via structure and method |
Randy Bindrup, W. Eric Boyd, John Leon, Angel Pepe |
2017-08-22 |
|
| 9431275 |
Wire bond through-via structure and method |
Randy Bindrup, W. Eric Boyd, John Leon, Angel Pepe |
2016-08-30 |
|
| 8637140 |
Method for defining an electrically conductive metal structure on a three-dimensional element and a device made from the method |
W. Eric Boyd |
2014-01-28 |
|
| 8637985 |
Anti-tamper wrapper interconnect method and a device |
Randy Bindrup, W. Eric Boyd |
2014-01-28 |
|
| 8609473 |
Method for fabricating a neo-layer using stud bumped bare die |
Peter Lieu, Randy Bindrup, W. Eric Boyd |
2013-12-17 |
|
| RE43877 |
Method for precision integrated circuit die singulation using differential etch rates |
David Ludwig, Stewart Clark, W. Eric Boyd |
2012-12-25 |
|
| 7786562 |
Stackable semiconductor chip layer comprising prefabricated trench interconnect vias |
Volkan Ozguz, Angel Pepe, W. Eric Boyd, Douglas Albert, Andrew Camien |
2010-08-31 |
|
| 7335576 |
Method for precision integrated circuit die singulation using differential etch rates |
Ludwig David, Stuart Clark, W. Eric Boyd |
2008-02-26 |
$294,000 |
| 7239012 |
Three-dimensional module comprised of layers containing IC chips with overlying interconnect layers |
Angel Pepe |
2007-07-03 |
$1,327,000 |
| 7127807 |
Process of manufacturing multilayer modules |
Angel Pepe, Volkan Ozguz, Andrew Camien |
2006-10-31 |
$335,000 |
| 6797537 |
Method of making stackable layers containing encapsulated integrated circuit chips with one or more overlaying interconnect layers |
Angel Pepe |
2004-09-28 |
$825,000 |
| 6784547 |
Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers |
Angel Pepe |
2004-08-31 |
$729,000 |
| 6734370 |
Multilayer modules with flexible substrates |
Angel Pepe, Volkan Ozguz, Andrew Camien |
2004-05-11 |
$1,013,000 |
| 6717061 |
Stacking of multilayer modules |
Angel Pepe, Volkan Ozguz, Andrew Camien |
2004-04-06 |
$1,228,000 |
| 6560109 |
Stack of multilayer modules with heat-focusing metal layer |
Angel Pepe, Volkan Ozguz, Andrew Camien |
2003-05-06 |
$435,000 |
| 6117704 |
Stackable layers containing encapsulated chips |
Volkan Ozguz, Andrew Camien |
2000-09-12 |
$4,633,000 |
| 6072234 |
Stack of equal layer neo-chips containing encapsulated IC chips of different sizes |
Andrew Camien |
2000-06-06 |
$7,389,000 |
| 5953588 |
Stackable layers containing encapsulated IC chips |
Andrew Camien |
1999-09-14 |
$947,000 |
| 5123164 |
Hermetic organic/inorganic interconnection substrate for hybrid circuit manufacture |
Joseph M. Shaheen |
1992-06-23 |
$4,164,000 |
| 5030499 |
Hermetic organic/inorganic interconnection substrate for hybrid circuit manufacture |
Joseph M. Shaheen |
1991-07-09 |
$13,635,000 |