Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Three-dimensional module comprised of layers containing IC chips with overlying interconnect layers

Three-dimensional module comprised of layers containing IC chips with overlying interconnect layers

US Patent 7239012 · Granted Jul 3, 2007

Estimated economic value: $1,327,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wire bond through-via structure and method2017
Wire bond through-via structure and method2017
Wire bond through-via structure and method2016
Wire bond through-via structure and method2016
Method for defining an electrically conductive metal structure on a three-dimens2014
Anti-tamper wrapper interconnect method and a device2014
Method for fabricating a neo-layer using stud bumped bare die2013
Method for precision integrated circuit die singulation using differential etch 2012
Stackable semiconductor chip layer comprising prefabricated trench interconnect 2010
Stackable semiconductor chip layer comprising prefabricated trench interconnect 2010
Method for precision integrated circuit die singulation using differential etch 2008
Process of manufacturing multilayer modules2006