Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8609473 | Method for fabricating a neo-layer using stud bumped bare die | James Yamaguchi, Randy Bindrup, W. Eric Boyd | 2013-12-17 |
| 8586407 | Method for depackaging prepackaged integrated circuit die and a product from the method | W. Eric Boyd | 2013-11-19 |