Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741680 | Wire bond through-via structure and method | W. Eric Boyd, John Leon, James Yamaguchi, Angel Pepe | 2017-08-22 |
| 9431275 | Wire bond through-via structure and method | W. Eric Boyd, John Leon, James Yamaguchi, Angel Pepe | 2016-08-30 |
| 8637985 | Anti-tamper wrapper interconnect method and a device | James Yamaguchi, W. Eric Boyd | 2014-01-28 |
| 8609473 | Method for fabricating a neo-layer using stud bumped bare die | Peter Lieu, James Yamaguchi, W. Eric Boyd | 2013-12-17 |
| 7772045 | Wire bond method for angularly disposed conductive pads and a device made from the method | — | 2010-08-10 |
| 7215854 | Low-loss optical waveguide crossovers using an out-of-plane waveguide | Arthur R. Telkamp | 2007-05-08 |
| 7062130 | Low-loss optical waveguide crossovers using an out-of-plane waveguide | Arthur R. Telkamp | 2006-06-13 |