Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7872339 | Vertically stacked pre-packaged integrated circuit chips | Keith Gann | 2011-01-18 |
| 7786562 | Stackable semiconductor chip layer comprising prefabricated trench interconnect vias | Volkan Ozguz, Angel Pepe, James Yamaguchi, W. Eric Boyd, Andrew Camien | 2010-08-31 |