Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7786562 | Stackable semiconductor chip layer comprising prefabricated trench interconnect vias | Volkan Ozguz, Angel Pepe, James Yamaguchi, W. Eric Boyd, Douglas Albert | 2010-08-31 |
| 7127807 | Process of manufacturing multilayer modules | James Yamaguchi, Angel Pepe, Volkan Ozguz | 2006-10-31 |
| 6734370 | Multilayer modules with flexible substrates | James Yamaguchi, Angel Pepe, Volkan Ozguz | 2004-05-11 |
| 6717061 | Stacking of multilayer modules | James Yamaguchi, Angel Pepe, Volkan Ozguz | 2004-04-06 |
| 6560109 | Stack of multilayer modules with heat-focusing metal layer | James Yamaguchi, Angel Pepe, Volkan Ozguz | 2003-05-06 |
| 6117704 | Stackable layers containing encapsulated chips | James Yamaguchi, Volkan Ozguz | 2000-09-12 |
| 6072234 | Stack of equal layer neo-chips containing encapsulated IC chips of different sizes | James Yamaguchi | 2000-06-06 |
| 5953588 | Stackable layers containing encapsulated IC chips | James Yamaguchi | 1999-09-14 |