Issued Patents All Time
Showing 26–50 of 100 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8198699 | Integrated circuit package with non-solder mask defined like pads | Yuanlin Xie | 2012-06-12 |
| 7883937 | Electronic package and method of forming the same | Teck-Gyu Kang, Yuanlin Xie | 2011-02-08 |
| 7834142 | Shortened glucagon-like peptide 1(sGLP-1) preparation method and application | — | 2010-11-16 |
| 7741160 | Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate | Wen-chou Vincent Wang, Bruce Euzent, Vadali Mahadev | 2010-06-22 |
| 7589414 | I/O Architecture for integrated circuit package | Jiangqi He, Michael Walk | 2009-09-15 |
| 7585702 | Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate | Wen-chou Vincent Wang, Bruce Euzent, Vadali Mahadev | 2009-09-08 |
| 7580269 | Apparatus for supplying power to a semiconductor device using a capacitor DC shunt | — | 2009-08-25 |
| 7518248 | Inductive filters and methods of fabrication therefor | David G. Figueroa | 2009-04-14 |
| 7492605 | Power plane to reduce voltage difference between connector power pins | Jayashree Kar, David G. Figueroa, Dong Zhong | 2009-02-17 |
| 7459782 | Stiffener for flip chip BGA package | — | 2008-12-02 |
| 7446399 | Pad structures to improve board-level reliability of solder-on-pad BGA structures | — | 2008-11-04 |
| 7427813 | Structure, material, and design for assembling a low-K Si die to achieve an industrial grade reliability wire bonding package | Wen-chou Vincent Wang | 2008-09-23 |
| 7417872 | Circuit board with trace configuration for high-speed digital differential signaling | Jiangqi He, Dong Zhong, David G. Figueroa | 2008-08-26 |
| 7358607 | Substrates and systems to minimize signal path discontinuities | David G. Figueroa | 2008-04-15 |
| 7329946 | I/O architecture for integrated circuit package | Jianqi He, Michael Walk | 2008-02-12 |
| 7321167 | Flex tape architecture for integrated circuit signal ingress/egress | Dong Zhong, Jianggi He, Jung Kang, Prashant Parmar, Hyunjun Kim +1 more | 2008-01-22 |
| 7317622 | Method and apparatus for supplying power to a semiconductor device using a capacitor DC shunt | — | 2008-01-08 |
| 7300822 | Low warpage flip chip package solution-channel heat spreader | — | 2007-11-27 |
| 7286368 | System to control effective series resistance of decoupling capacitor | Dong Zhong, David G. Figueroa, Michael DeSmith | 2007-10-23 |
| 7221046 | System to control effective series resistance of power delivery circuit | Dong Zhong, David G. Figueroa | 2007-05-22 |
| 7215530 | High ESR low ESL capacitor | David G. Figueroa, Nicholas Holmberg | 2007-05-08 |
| 7212395 | Capacitor design for controlling equivalent series resistance | David G. Figueroa, Farzaneh Yahyaei-Moayyed, Dong Zhong | 2007-05-01 |
| 7211894 | Capacitor-related systems for addressing package/motherboard resonance | Jennifer A. Hester, Michael DeSmith, David G. Figueroa, Dong Zhong | 2007-05-01 |
| 7205638 | Silicon building blocks in integrated circuit packaging | David G. Figueroa, Dong Zhong, Jiangqi He, Cengiz A. Palanduz | 2007-04-17 |
| 7176565 | Capacitors having separate terminals on three or more sides | David G. Figueroa, Chee-Yee Chung | 2007-02-13 |