Issued Patents All Time
Showing 25 most recent of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418097 | Microelectronic device package including antenna and semiconductor device | Rajen Manicon Murugan, Juan Alejandro Herbsommer | 2025-09-16 |
| 12406915 | Plated metal layer in power packages | Jonathan Almeria Noquil, Makarand Ramkrishna Kulkarni, Osvaldo Jorge Lopez, Rajen Manicon Murugan, Liang Wan | 2025-09-02 |
| 12400945 | Electronic device multilevel package substrate for improved electromigration performance | Sylvester Ankamah-Kusi, Rajen Manicon Murugan, Sreenivasan K. Koduri | 2025-08-26 |
| 12381139 | Electronic device and multilevel package substrate with elevated trace features for solder and/or die confinement and method for fabricating the electronic device | Guangxu Li, Rajen Manicon Murugan | 2025-08-05 |
| 12374608 | Hybrid chip carrier package | Li Jiang, Rajen Manicon Murugan, Robert Falcone, Usman Mahmood Chaudhry | 2025-07-29 |
| 12327736 | Multilayer package substrate with improved current density distribution | Rajen Manicon Murugan, Phuong Minh Vu, Sylvester Ankamah-Kusi | 2025-06-10 |
| 12322856 | Antenna in package having antenna on package substrate | Makarand Ramkrishna Kulkarni, Liang Wan, Rajen Manicon Murugan | 2025-06-03 |
| 12315987 | Antenna-on-package system | Rajen Manicon Murugan | 2025-05-27 |
| 12266596 | Semiconductor device with a power converter module connected to connection assembly | Rajen Manicon Murugan | 2025-04-01 |
| 12243911 | Integrated circuit package for isolation dies | Matthew David Romig, Enis Tuncer, Rajen Manicon Murugan | 2025-03-04 |
| 12243849 | Passives to facilitate mold compound flow | Chittranjan Mohan Gupta, Rajen Manicon Murugan, Jie Chen, Tianyi Luo | 2025-03-04 |
| 12224480 | Microelectronic device package including antenna horn and semiconductor device | Rajen Manicon Murugan | 2025-02-11 |
| 12218036 | Package substrate having integrated passive device(s) between leads | Rajen Manicon Murugan | 2025-02-04 |
| 12211800 | Semiconductor package with shunt and patterned metal trace | Rajen Manicon Murugan, Liang Wan, Makarand Ramkrishna Kulkarni, Jie Chen, Steven Kummerl | 2025-01-28 |
| 12191259 | Multi-channel gate driver package with grounded shield metal | Rajen Manicon Murugan, Jie Chen | 2025-01-07 |
| 12165989 | Semiconductor package with electromagnetic interference shielding | Jie Chen, Rajen Manicon Murugan, Liang Wan | 2024-12-10 |
| 12148556 | Integrated magnetic assembly | Rajen Manicon Murugan, Jonathan Almeria Noquil | 2024-11-19 |
| 12113293 | Antenna-on-package including multiple types of antenna | Rajen Manicon Murugan | 2024-10-08 |
| 12040265 | High-frequency ceramic packages with modified castellation and metal layer architectures | Rajen Manicon Murugan, Li Jiang | 2024-07-16 |
| 11978709 | Integrated system-in-package with radiation shielding | Vivek Swaminathan Sridharan, Christopher Daniel Manack, Rajen Manicon Murugan, Liang Wan, Hiep Xuan Nguyen | 2024-05-07 |
| 11978699 | Electronic device multilevel package substrate for improved electromigration preformance | Sylvester Ankamah-Kusi, Rajen Manicon Murugan, Sreenivasan K. Koduri | 2024-05-07 |
| 11955479 | Packaged semiconductor device | Rajen Manicon Murugan, Makarand Ramkrishna Kulkarni | 2024-04-09 |
| 11901271 | High current packages with reduced solder layer count | Liang Wan, William Todd Harrison, Manu J. Prakuzhy, Rajen Manicon Murugan | 2024-02-13 |
| 11881460 | Ceramic semiconductor package seal rings | Li Jiang, Rajen Manicon Murugan | 2024-01-23 |
| 11837775 | Microelectronic device package including antenna and semiconductor device | Rajen Manicon Murugan, Juan Alejandro Herbsommer | 2023-12-05 |