Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239127 | Topside-cooled semiconductor package with molded standoff | Edward Myers, Liu Chen, Chee Chiew Chong, Wee Aun Jason Lim | 2022-02-01 |
| 11183451 | Interconnect clip with angled contact surface and raised bridge | Chai Chee Lee | 2021-11-23 |
| 10978378 | Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier | Thomas Bemmerl, Kuok Wai Chan, Christoph Liebl, Bun Kian Tay, Wae Chet Yong | 2021-04-13 |
| 10037934 | Semiconductor chip package having contact pins at short side edges | Ralf Otremba, Chooi Mei Chong, Raynold Talavera Corocotchia, Teck Sim Lee, Sanjay Kumar Murugan +2 more | 2018-07-31 |
| 9728492 | Strip testing of semiconductor devices | Thiong Zhou See, Lay Yeap Lim | 2017-08-08 |
| 9640459 | Semiconductor device including a solder barrier | Kuan Ching Woo, Paul Armand Asentista Calo | 2017-05-02 |