Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9059177 | Doping of copper wiring structures in back end of line processing | Thomas W. Dyer, Daniel C. Edelstein, Andrew H. Simon, Wei-Tsu Tseng | 2015-06-16 |
| 9018097 | Semiconductor device processing with reduced wiring puddle formation | Thomas W. Dyer, Hanako Henry, Yiheng Xu, Shaoning Yao | 2015-04-28 |
| 8765602 | Doping of copper wiring structures in back end of line processing | Thomas W. Dyer, Daniel C. Edelstein, Andrew H. Simon, Wei-Tsu Tseng | 2014-07-01 |
| 8623673 | Structure and method for detecting defects in BEOL processing | Thomas W. Dyer, Yiheng Xu, Shaoning Yao | 2014-01-07 |
| 7488679 | Interconnect structure and process of making the same | Theodorus E. Standaert, Pegeen M. Davis, John A. Fitzsimmons, Stephen E. Greco, Naftali E. Lustig +2 more | 2009-02-10 |