Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8709948 | Tungsten barrier and seed for copper filled TSV | Michal Danek, Jonathan D. Reid, Juwen Gao, Aaron R. Fellis | 2014-04-29 |
| 8173537 | Methods for reducing UV and dielectric diffusion barrier interaction | Kaushik Chattopadhyay, Keith Fox, Hui-Jung Wu, Bart J. van Schravendijk, Kimberly Branshaw | 2012-05-08 |
| 8124522 | Reducing UV and dielectric diffusion barrier interaction through the modulation of optical properties | Hui-Jung Wu, Kimberly Shafi, Kaushik Chattopadhyay, Keith Fox, Girish Dixit +2 more | 2012-02-28 |
| 8003549 | Methods of forming moisture barrier for low K film integration with anti-reflective layers | Ming Li, Bart J. van Schravendijk, Chiu Chi, Kevin J. Ilcisin, Julian J. Hsieh | 2011-08-23 |
| 7682966 | Multistep method of depositing metal seed layers | Robert T. Rozbicki, Bart J. van Schravendijk, Wen Wu | 2010-03-23 |
| 7642202 | Methods of forming moisture barrier for low k film integration with anti-reflective layers | Ming Li, Bart J. van Schravendijk, Chiu Chi, Kevin J. Ilcisin, Julian J. Hsieh | 2010-01-05 |
| 7052988 | Applications and methods of making nitrogen-free anti-reflective layers for semiconductor processing | Bart J. van Schravendijk, Ming Li, Jason Tian, M. Ziaul Karim | 2006-05-30 |
| 6720251 | Applications and methods of making nitrogen-free anti-reflective layers for semiconductor processing | Bart J. van Schravendijk, Ming Li, Jason Tian, M. Zlaul Karim | 2004-04-13 |