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Embedded metal-insulator-metal capacitor |
Robert Seidel |
2017-06-20 |
| 9478602 |
Method of forming an embedded metal-insulator-metal (MIM) capacitor |
Robert Seidel |
2016-10-25 |
| 9305878 |
Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects |
Carsten Peters, Andreas Ott, Axel Preusse |
2016-04-05 |
| 9287109 |
Methods of forming a protection layer to protect a metal hard mask layer during lithography reworking processes |
Keith Donegan, Robert Seidel |
2016-03-15 |
| 9257329 |
Methods for fabricating integrated circuits including densifying interlevel dielectric layers |
Oliver Mieth, Carsten Peters |
2016-02-09 |
| 8932911 |
Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects |
Carsten Peters, Andreas Ott, Axel Preusse |
2015-01-13 |
| 8922023 |
Semiconductor device comprising metallization layers of reduced interlayer capacitance by reducing the amount of etch stop materials |
Jens Heinrich, Ralf Richter, Ronny Pfutzner |
2014-12-30 |
| 8859418 |
Methods of forming conductive structures using a dual metal hard mask technique |
Jens Hahn, Kai Frohberg |
2014-10-14 |
| 8786088 |
Semiconductor device including ultra low-K (ULK) metallization stacks with reduced chip-package interaction |
Jens Heinrich, Kai Frohberg, Frank Feustel |
2014-07-22 |
| 8673770 |
Methods of forming conductive structures in dielectric layers on an integrated circuit device |
Jens Heinrich, Ronny Pfuetzner |
2014-03-18 |
| 8598714 |
Semiconductor device comprising through hole vias having a stress relaxation mechanism |
Michael Grillberger, Jens Hahn |
2013-12-03 |
| 8536050 |
Selective shrinkage of contact elements in a semiconductor device |
Kai Frohberg, Ralf Richter, Katrin Reiche |
2013-09-17 |
| 8492269 |
Hybrid contact structure with low aspect ratio contacts in a semiconductor device |
Jens Heinrich, Ralf Richter, Kai Frohberg |
2013-07-23 |
| 8435841 |
Enhancement of ultraviolet curing of tensile stress liner using reflective materials |
Ralf Richter |
2013-05-07 |
| 8399335 |
Sophisticated metallization systems in semiconductors formed by removing damaged dielectric layers after forming the metal features |
Michael Grillberger, Frank Feustel |
2013-03-19 |
| 8383510 |
Semiconductor device comprising metallization layers of reduced interlayer capacitance by reducing the amount of etch stop materials |
Jens Heinrich, Ralf Richter, Ronny Pfuetzner |
2013-02-26 |
| 8324108 |
Increasing robustness of a dual stress liner approach in a semiconductor device by applying a wet chemistry |
Ralf Richter, Markus Lenski |
2012-12-04 |
| 8216928 |
Methods for fabricating semiconductor devices having local contacts |
Ralf Richter, Jens Heinrich |
2012-07-10 |
| 7985668 |
Method for forming a metal silicide having a lower potential for containing material defects |
Ralf Richter, Jens Heinrich |
2011-07-26 |