Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935861 | Underfill flow management in electronic assemblies | Frederick Atadana, Taylor Gaines, Edvin Cetegen, Wei Li, Hsin-Yu Li | 2024-03-19 |
| 9859248 | Laser die backside film removal for integrated circuit (IC) packaging | Danish Faruqui, Edward R. Prack, Sergei Voronov, David K. Wilkinson, JR., Lars D. Skoglund +3 more | 2018-01-02 |
| 9824991 | Organic thin film passivation of metal interconnections | Aleksandar Aleksov, Danish Faruqui, Mark S. Hlad, Edward R. Prack | 2017-11-21 |
| 9583390 | Organic thin film passivation of metal interconnections | Aleksandar Aleksov, Danish Faruqui, Mark S. Hlad, Edward R. Prack | 2017-02-28 |
| 9412702 | Laser die backside film removal for integrated circuit (IC) packaging | Danish Faruqui, Edward R. Prack, Sergei Voronov, David K. Wilkinson, JR., Lars D. Skoglund +3 more | 2016-08-09 |
| 9257276 | Organic thin film passivation of metal interconnections | Aleksandar Aleksov, Danish Faruqui, Mark S. Hlad, Edward R. Prack | 2016-02-09 |
| 7427565 | Multi-step etch for metal bump formation | Ralph Lane | 2008-09-23 |
| 7402501 | Method of manufacturing a coaxial trace in a surrounding material, coaxial trace formed thereby, and semiconducting material containing same | — | 2008-07-22 |
| 7354799 | Methods for anchoring a seal ring to a substrate using vias and assemblies including an anchored seal ring | Daniel J. Kinderknecht | 2008-04-08 |