| 8184748 |
Narrow band receiver |
Peter Massam, Philip Alan Bowden, Timothy David Howe |
2012-05-22 |
| 7811903 |
Thin flip-chip method |
Ford B. Grigg |
2010-10-12 |
| 7755204 |
Stacked die module including multiple adhesives that cure at different temperatures |
Chad A. Cobbley |
2010-07-13 |
| 7355273 |
Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods |
Tim Murphy |
2008-04-08 |
| 7291543 |
Thin flip-chip method |
Ford B. Grigg |
2007-11-06 |
| 7217596 |
Stacked die module and techniques for forming a stacked die module |
Chad A. Cobbley |
2007-05-15 |
| 7186576 |
Stacked die module and techniques for forming a stacked die module |
Chad A. Cobbley |
2007-03-06 |
| 7029931 |
Stacked die module and techniques for forming a stacked die module |
Chad A. Cobbley |
2006-04-18 |
| 6988225 |
Verifying a fault detection result based on a process control state |
Matthew A. Purdy, Richard J. Markle |
2006-01-17 |
| 6985825 |
Method and apparatus for adaptive sampling based on process covariance |
Richard P. Good, Brian K. Cusson |
2006-01-10 |
| 6962867 |
Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof |
Tim Murphy |
2005-11-08 |
| 6925347 |
Process control based on an estimated process result |
Michael L. Miller, Thomas J. Sonderman, Alexander J. Pasadyn, Richard J. Markle, Brian K. Cusson +2 more |
2005-08-02 |
| 6905946 |
Thin flip-chip method |
Ford B. Grigg |
2005-06-14 |
| 6800930 |
Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies |
Tim Murphy |
2004-10-05 |
| 6682955 |
Stacked die module and techniques for forming a stacked die module |
Chad A. Cobbley |
2004-01-27 |
| 6664131 |
Method of making ball grid array package with deflectable interconnect |
— |
2003-12-16 |
| 6630738 |
Deflectable interconnect |
— |
2003-10-07 |
| 6563300 |
Method and apparatus for fault detection using multiple tool error signals |
Richard J. Markle, Edward C. Stewart |
2003-05-13 |
| 6506681 |
Thin flip—chip method |
Ford B. Grigg |
2003-01-14 |
| 6503777 |
Deflectable interconnect |
— |
2003-01-07 |
| 6501176 |
Deflectable interconnect |
— |
2002-12-31 |
| 6285081 |
Deflectable interconnect |
— |
2001-09-04 |
| 6244064 |
Combination toolbox-cooler device |
Arthur G. Powell, Melvin T. Willis, Sr., Maurice L. Monroe, Benjamin Scandrett |
2001-06-12 |
| 5410124 |
Tracking sensor fixture and method for tracking reference locations on a moving semiconductor leadframe strip |
— |
1995-04-25 |
| 5048664 |
Reciprocating staging fixture |
Ronald M. Gines |
1991-09-17 |