TG

Thomas Gutt

Infineon Technologies Ag: 11 patents #789 of 7,486Top 15%
IA Infineon Technologies Austria Ag: 4 patents #261 of 1,126Top 25%
SC Schaeffler: 1 patents #1,192 of 2,365Top 55%
📍 Höhenkirchen-Siegertsbrunn, DE: #5 of 132 inventorsTop 4%
Overall (All Time): #296,305 of 4,157,543Top 8%
16
Patents All Time

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #TitleCo-InventorsDate
10347490 Production of an integrated circuit including electrical contact on SiC Roland Rupp, Michael Treu 2019-07-09
9634108 Method of manufacturing a device by locally heating one or more metalization layers and by means of selective etching Roland Rupp, Stefan Woehlert, Michael Treu 2017-04-25
9613805 Method for forming a semiconductor device Werner Schustereder, Holger Schulze, Johannes Georg Laven, Roman Baburske, Rudolf Berger 2017-04-04
9391154 Method of manufacturing a device by locally heating one or more metalization layers and by means of selective etching Roland Rupp, Stefan Woehlert, Michael Treu 2016-07-12
9240450 IGBT with emitter electrode electrically connected with impurity zone Dorothea Werber, Volodymyr Komarnitskyy 2016-01-19
9209109 IGBT with emitter electrode electrically connected with an impurity zone Dorothea Werber, Mathias Plappert, Frank Pfirsch 2015-12-08
9209281 Method of manufacturing a device by locally heating one or more metallization layers and by means of selective etching Roland Rupp, Stefan Woehlert, Michael Treu 2015-12-08
8895422 Production of an integrated circuit including electrical contact on SiC Roland Rupp, Michael Treu 2014-11-25
8541892 Bonding connection between a bonding wire and a power semiconductor chip Dirk Siepe, Roman Roth 2013-09-24
8475326 Outer plate carrier Oliver Noehl, Michael Schlosser, Frank Feurer 2013-07-02
8450196 Production of an integrated circuit including electrical contact on SiC Roland Rupp, Michael Treu 2013-05-28
8011319 Method for oxidizing a layer, and associated holding devices for a substrate Hin Yiu Anthony Chung 2011-09-06
7851913 Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart Dirk Siepe, Thomas Laska, Michael Melzl, Matthias Stecher, Roman Roth 2010-12-14
7842590 Method for manufacturing a semiconductor substrate including laser annealing Frank Umbach, Hans Peter Felsl, Manfred Pfaffenlehner, Franz-Josef Niedernostheide, Holger Schulze 2010-11-30
7723158 Method for producing and cleaning surface-mountable bases with external contacts Sokratis Sgouridis 2010-05-25
7615499 Method for oxidizing a layer, and associated holding devices for a substrate Hin Yiu Anthony Chung 2009-11-10