Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224262 | Substrate bonding apparatus and method of manufacturing semiconductor device by using the same | Ilyoung Han, Hoechul Kim | 2025-02-11 |
| 12175023 | Method and device for displaying notification message | Jookwan LEE, Myunghoon KWAK, Yangwook KIM, Jihea PARK | 2024-12-24 |
| 12086393 | Communication method and device using avatar in virtual space | Youngrog KIM, Moonjeong Kim, Wonkyu SUNG, Taeyang SONG, Jonghyuck YOO +3 more | 2024-09-10 |
| 11990444 | Substrate bonding apparatus and method of manufacturing semiconductor device by using the same | Ilyoung Han, Hoechul Kim | 2024-05-21 |
| 11922842 | Electronic device having extendable display and method for providing content thereof | Myunghoon KWAK, Moonjeong Kim, Sunghwan PARK, Jookwan LEE, Yangwook KIM +1 more | 2024-03-05 |
| 11728197 | Wafer to wafer bonding apparatus and wafer to wafer bonding method | Jaehyun PHEE, Hoechul Kim, Seokho Kim, Hoonjoo Na | 2023-08-15 |
| 11721562 | Substrate bonding apparatus | Hyungjun Jeon, Hoechul Kim, Junhong Min | 2023-08-08 |
| 11594443 | Substrate bonding apparatus and method of manufacturing semiconductor device by using the substrate bonding apparatus | Hoechul Kim, Hakjun Lee, Hoonjoo Na | 2023-02-28 |
| 10950470 | Substrate bonding apparatus and bonding method using the same | Minsoo Han, Jun-Hyung Kim, Hoonjoo Na, Kwangjin Moon | 2021-03-16 |
| 10931482 | Method and apparatus for channel estimation in wireless communication system | Jongho OH, Soon Chan Kwon, Daehoon Kim, Jungmin Yoon | 2021-02-23 |
| 10923452 | Substrate bonding apparatus | Ilyoung Han, Jihoon Kang, Nohsung Kwak, Seokho Kim, Hoechul Kim +2 more | 2021-02-16 |
| 10541837 | Method and apparatus for channel estimation in wireless communication system | Jongho OH, Soon Chan Kwon, Daehoon Kim, Jungmin Yoon | 2020-01-21 |
| 10411062 | Substrate bonding apparatus having adsorption sectors with different vacuum pressures and method of manufacturing semiconductor device using the same | Jun-Hyung Kim, Seokho Kim, Sunghyup Kim, Jaegeun Kim | 2019-09-10 |
| 9847276 | Semiconductor devices having through-electrodes and methods for fabricating the same | Pil-Kyu Kang, Byung-Lyul Park, Sunghee KANG, Taeseong Kim, Kwangjin Moon +6 more | 2017-12-19 |
| 9653430 | Semiconductor devices having stacked structures and methods for fabricating the same | Byung-Lyul Park, Seokho Kim, Pil-Kyu Kang, Hyoju Kim, Jin Ho An +1 more | 2017-05-16 |
| 9583373 | Wafer carrier having cavity | Ho-Jin Lee, Pil-Kyu Kang, Byung-Lyul Park, Kyu-Ha Lee, Gilheyun Choi | 2017-02-28 |
| 9530706 | Semiconductor devices having hybrid stacking structures and methods of fabricating the same | Pil-Kyu Kang, Byung-Lyul Park, Yeun-Sang Park, Dosun Lee, Ho-Jin Lee +3 more | 2016-12-27 |
| 9070748 | Semiconductor devices having through-vias and methods for fabricating the same | Pil-Kyu Kang, Byung-Lyul Park, Jumyong Park, Jinho Park, Kyu-Ha Lee +2 more | 2015-06-30 |