SK

Stephen Kilpatrick

IBM: 8 patents #13,150 of 70,183Top 20%
UA US Army: 1 patents #2,720 of 6,974Top 40%
Overall (All Time): #572,164 of 4,157,543Top 15%
9
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9252704 Voltage tunable oscillator using bilayer graphene and a lead zirconate titanate capacitor Osama M. Nayfeh, James Wilson, Madam Dubey, Ronald G. Polcawich 2016-02-02
8026613 Interconnections for flip-chip using lead-free solders and having reaction barrier layers Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Paul A. Lauro, Henry A. Nye, III +2 more 2011-09-27
7923849 Interconnections for flip-chip using lead-free solders and having reaction barrier layers Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Paul A. Lauro, Henry A. Nye, III +2 more 2011-04-12
7410833 Interconnections for flip-chip using lead-free solders and having reaction barrier layers Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Paul A. Lauro, Henry A. Nye, III +2 more 2008-08-12
7276296 Immersion plating and plated structures Emanuel I. Cooper, Charles C. Goldsmith, Carmen M. Mojica, Henry A. Nye, III 2007-10-02
7273803 Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure Yu-Ting Cheng, Stefanie Chiras, Donald W. Henderson, Sung Kwon Kang, Henry A. Nye, III +2 more 2007-09-25
7037559 Immersion plating and plated structures Emanuel I. Cooper, Charles C. Goldsmith, Carmen M. Mojica, Henry A. Nye, III 2006-05-02
6900142 Inhibition of tin oxide formation in lead free interconnect formation Emanual I. Cooper, John M. Cotte, Lisa A. Fanti, David E. Eichstadt, Henry A. Nye, III +1 more 2005-05-31
6893799 Dual-solder flip-chip solder bump David Danovitch 2005-05-17