SK

Steven M. Kandetzke

IBM: 14 patents #8,004 of 70,183Top 15%
Overall (All Time): #357,947 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
5277725 Process for fabricating a low dielectric composite substrate John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more 1994-01-11
5147741 Phenyl-endcapped depolymerizable polymer Constance J. Araps, Jon A. Casey, Renuka S. Divakaruni, Catherine A. Lotsko 1992-09-15
5139851 Low dielectric composite substrate John Acocella, Arnold I. Baise, Richard A. Bates, Jon A. Casey, David R. Clarke +10 more 1992-08-18
5135595 Process for fabricating a low dielectric composite substrate John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more 1992-08-04
4987211 Phenyl-endcapped depolymerizable polymer Constance J. Araps, Jon A. Casey, Renuka S. Divakaruni, Chatherine A. Lotsko 1991-01-22
4885038 Method of making multilayered ceramic structures having an internal distribution of copper-based conductors Herbert R. Anderson, Jr., Renuka S. Divakaruni, Joseph M. Dynys, Daniel P. Kirby, Raj N. Master +1 more 1989-12-05
4871619 Electronic components comprising polymide dielectric layers Constance J. Araps, Mark A. Takacs 1989-10-03
4749621 Electronic components comprising polyimide-filled isolation structures Constance J. Araps, Mark A. Takacs 1988-06-07
4699803 Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers Constance J. Araps, Mark A. Takacs 1987-10-13
4656050 Method of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymers Constance J. Araps, Mark A. Takacs 1987-04-07
4654223 Method for forming a film of dielectric material on an electric component Constance J. Araps, Mark A. Takacs 1987-03-31
4622383 Method for the fractionation of reactive terminated polymerizable oligomers Constance J. Araps, Mark A. Takacs 1986-11-11
4599136 Method for preparation of semiconductor structures and devices which utilize polymeric dielectric materials Constance J. Araps, Ellen L. Kutner, Mark A. Takacs 1986-07-08
4568601 Use of radiation sensitive polymerizable oligomers to produce polyimide negative resists and planarized dielectric components for semiconductor structures Constance J. Araps, George Czornyj, Mark A. Takacs 1986-02-04