| 11385949 |
Apparatus having a multiplexer for passive input/output expansion |
Suresh Rajgopal, Dan Soto |
2022-07-12 |
| 11347415 |
Selection component that is configured based on an architecture associated with memory devices |
Suresh Rajgopal, Henrico L. Yahja, Dustin J. Carter |
2022-05-31 |
| 10877678 |
Selection component that is configured based on an architecture associated with memory devices |
Suresh Rajgopal, Henrico L. Yahja, Dustin J. Carter |
2020-12-29 |
| 10846158 |
Apparatus having multiplexers for passive input/output expansion and methods of their operation |
Suresh Rajgopal, Dan Soto |
2020-11-24 |
| 10366934 |
Face down dual sided chip scale memory package |
Chan H. Yoo, Akshay N. Singh, Yi Xu, Liana Foster |
2019-07-30 |
| 10153221 |
Face down dual sided chip scale memory package |
Chan H. Yoo, Akshay N. Singh, Yi Xu, Liana Foster |
2018-12-11 |
| 9269403 |
Independent control of stacked electronic modules |
Robert N. Schenck |
2016-02-23 |
| 8999763 |
Package including an interposer having at least one topological feature |
Aravind Ramamoorthy |
2015-04-07 |
| 8952515 |
Signal shifting to allow independent control of identical stacked memory modules |
Robert N. Schenck |
2015-02-10 |
| 8860496 |
Methods for receiving and transmitting voltage through the use of supply voltage or ground connections including bond pad interconnects for integrated circuit devices |
Mostafa Naguib Abdulla |
2014-10-14 |
| 8829693 |
Supply voltage or ground connections for integrated circuit device |
Mostafa Naguib Abdulla |
2014-09-09 |
| 8749074 |
Package including an interposer having at least one topological feature |
Aravind Ramamoorthy |
2014-06-10 |
| 8536716 |
Supply voltage or ground connections for integrated circuit device |
Mostafa Naguib Abdulla |
2013-09-17 |
| 8531849 |
Supply voltage or ground connections including bond pad interconnects for integrated circuit device |
Mostafa Naguib Abdulla |
2013-09-10 |
| 8198717 |
Signal shifting to allow independent control of identical stacked memory modules |
Robert N. Schenck |
2012-06-12 |
| 7823279 |
Method for using an in package power supply to supply power to an integrated circuit and to a component |
Duane R. Mills |
2010-11-02 |
| 7533457 |
Packaging method for circuit board |
Richard Foehringer, Jason Snodgress, John G. Meyers |
2009-05-19 |
| 6704204 |
IC package with edge connect contacts |
Jeffrey C. Franz, David S. Brannam |
2004-03-09 |
| 6655022 |
Implementing micro BGA assembly techniques for small die |
Richard Foehringer, Deborah S. Kaller |
2003-12-02 |
| 6605875 |
Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size |
— |
2003-08-12 |
| 6547570 |
IC package with quick connect feature |
Jeffrey C. Franz, David S. Brannam |
2003-04-15 |
| 6489557 |
Implementing micro BGA™ assembly techniques for small die |
Richard Foehringer, Deborah S. Kaller |
2002-12-03 |
| 6356456 |
Low pin count card retainer |
— |
2002-03-12 |
| 6250934 |
IC package with quick connect feature |
Jeffrey C. Franz, David S. Brannam |
2001-06-26 |
| 5336456 |
Method of producing a scribelined layout structure for plastic encapsulated circuits |
Suresh Golwalkar, Tito Barrios |
1994-08-09 |
