SY

Seung Wook Yoon

SC Stats Chippac: 19 patents #132 of 425Top 35%
JC Jcet Semiconductor (Shaoxing) Co.: 2 patents #6 of 38Top 20%
AR Agency For Science, Technology And Research: 1 patents #909 of 2,337Top 40%
GT Gwangju Institute Of Science And Technology: 1 patents #260 of 901Top 30%
Overall (All Time): #170,179 of 4,157,543Top 5%
24
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12094729 Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP Yaojian Lin, Heinz-Peter Wirtz, Pandi C. Marimuthu 2024-09-17
12096217 PUF-based IoT device using channel state information, and authentication method thereof Eui Seok Hwang, Seung Nam HAN 2024-09-17
11961764 Semiconductor device and method of making a wafer-level chip-scale package Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz +1 more 2024-04-16
11257729 Semiconductor device and method of forming encapsulated wafer level chip scale package (eWLCSP) Thomas Strothmann, Yaojian Lin 2022-02-22
11222793 Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP Yaojian Lin, Heinz-Peter Wirtz, Pandi C. Marimuthu 2022-01-11
11011423 Semiconductor device and method of using a standardized carrier in semiconductor packaging Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz +1 more 2021-05-18
10903304 Semiconductor device and method of forming inductor over insulating material filled trench in substrate Meenakshi Padmanathan, YongTaek Lee 2021-01-26
10622293 Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP) Jose Alvin Caparas, Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Xusheng Bao +1 more 2020-04-14
10515828 Method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP Yaojian Lin, Heinz-Peter Wirtz, Pandi C. Marimuthu 2019-12-24
10475779 Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP Yaojian Lin, Kang Chen 2019-11-12
10446459 Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP) Thomas Strothmann, Yaojian Lin 2019-10-15
10213396 Patch to enhance locally fat metabolism, using thermoplastic elastomer gel composition including capsaicin Kyu Hak Cho 2019-02-26
10181423 Semiconductor device and method of using a standardized carrier in semiconductor packaging Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz +1 more 2019-01-15
9768155 Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP Yaojian Lin, Kang Chen 2017-09-19
9704769 Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP) Thomas Strothmann, Yaojian Lin 2017-07-11
9640603 Semiconductor device and method of forming inductor over insulating material filled trench in substrate Meenakshi Padmanathan, YongTaek Lee 2017-05-02
9620413 Semiconductor device and method of using a standardized carrier in semiconductor packaging Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz +1 more 2017-04-11
9496195 Semiconductor device and method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP Yaojian Lin, Heinz-Peter Wirtz, Pandi C. Marimuthu 2016-11-15
9293401 Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP) Jose Alvin Caparas, Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Xusheng Bao +1 more 2016-03-22
9224647 Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposer Jun Mo Koo, Pandi C. Marimuthu, Jae Hun Ku 2015-12-29
9224693 Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier Reza A. Pagaila, Yaojian Lin 2015-12-29
9064936 Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP Yaojian Lin, Kang Chen 2015-06-23
8993377 Semiconductor device and method of bonding different size semiconductor die at the wafer level Jun Mo Koo, Pandi C. Marimuthu, Il Kwon Shim 2015-03-31
7160756 Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices Vaidyanathan Kripesh, Ganesh Vetrivel Periasamy 2007-01-09