Issued Patents All Time
Showing 1–25 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394700 | Semiconductor package | Dongkyu Kim, Kyoung Lim Suk, Jaegwon Jang, Gwangjae Jeon | 2025-08-19 |
| 12394753 | Semiconductor package | Hyeonseok LEE, Jongyoun Kim | 2025-08-19 |
| 12388040 | Semiconductor package including redistribution substrate and method of manufacturing the same | Dongkyu Kim, Kyounglim Suk, Hyeonjeong Hwang | 2025-08-12 |
| 12327824 | Semiconductor package including redistribution substrate | Dongkyu Kim, Daeho Lee, Minjung Kim, Taewon Yoo | 2025-06-10 |
| 12322702 | Semiconductor package | Dongkyu Kim, Seokkyu Choi, Minjung Kim | 2025-06-03 |
| 12300625 | Semiconductor package including outer conductive plate | Minjung Kim, Dongkyu Kim, Jongyoun Kim, Jaegwon Jang | 2025-05-13 |
| 12300589 | Semiconductor package | Gwangjae Jeon, Jung-Ho Park, Yaejung YOON | 2025-05-13 |
| 12293989 | Semiconductor package | Minjung Kim, Dongkyu Kim, Jongyoun Kim | 2025-05-06 |
| 12261106 | Semiconductor package | Hyeonjeong Hwang, Kyoung Lim Suk, Jaegwon Jang | 2025-03-25 |
| 12237256 | Semiconductor package | Kyoung Lim Suk, Keung Beum Kim, Dongkyu Kim, Minjung Kim | 2025-02-25 |
| 12237250 | Semiconductor package | Dongkyu Kim, Minjung Kim, Kyounglim Suk | 2025-02-25 |
| 12205914 | Semiconductor package | Inhyung SONG, Jongyoun Kim | 2025-01-21 |
| 12205939 | Semiconductor package | Doohwan Lee, Jeongho Lee | 2025-01-21 |
| 12170251 | Semiconductor package | Kyoung Lim Suk, Jaegwon Jang | 2024-12-17 |
| 12087744 | Semiconductor package device | Dongkyu Kim, Yeonho Jang, Jaegwon Jang | 2024-09-10 |
| 12057435 | Semiconductor package | Hyeonseok LEE, Jongyoun Kim | 2024-08-06 |
| 12040264 | Semiconductor package including under bump metallization pad | Hyeonjeong Hwang, Kyounglim Suk | 2024-07-16 |
| 12034949 | Video decoding apparatus and video decoding method | Taesung Kim | 2024-07-09 |
| 12015018 | Semiconductor package with multiple redistribution substrates | Hyeonjeong Hwang, Kyoung Lim Suk, Jaegwon Jang | 2024-06-18 |
| 12009350 | Semiconductor package and method of fabricating the same | Kyoung Lim Suk | 2024-06-11 |
| 11973028 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Jongyoun Kim, Minjun Bae | 2024-04-30 |
| 11942586 | Display module package | Dahye Kim, Jungho Park | 2024-03-26 |
| 11869835 | Semiconductor package | Jongyoun Kim, Yeonho Jang, Jaegwon Jang | 2024-01-09 |
| 11869775 | Semiconductor packages | Kyoung Lim Suk, Ae-Nee Jang, Jaegwon Jang | 2024-01-09 |
| 11858772 | Strip cutting apparatus for diagnostic reagent kit | — | 2024-01-02 |