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Method and apparatus for in-situ testing of integrated circuit chips |
Anilkumar C. Bhatt, Leo Raymond Buda, Robert D. Edwards, Paul Joseph Hart, Anthony P. Ingraham +6 more |
2002-07-02 |
| 5685070 |
Method of making printed circuit board |
Warren A. Alpaugh, Voya R. Markovich, Ajit K. Trivedi |
1997-11-11 |
| 5672260 |
Process for selective application of solder to circuit packages |
Charles F. Carey, Kenneth Michael Fallon, Voya R. Markovich, Douglas O. Powell, Gary Paul Vlasak |
1997-09-30 |
| 5656139 |
Electroplating apparatus |
Charles F. Carey, Kenneth Michael Fallon, Voya R. Markovich, Douglas O. Powell, Gary Paul Vlasak |
1997-08-12 |
| 5597469 |
Process for selective application of solder to circuit packages |
Charles F. Carey, Kenneth Michael Fallon, Voya R. Markovich, Douglas O. Powell, Gary Paul Vlasak |
1997-01-28 |
| 5418689 |
Printed circuit board or card for direct chip attachment and fabrication thereof |
Warren A. Alpaugh, Voya R. Markovich, Ajit K. Trivedi |
1995-05-23 |
| 5316788 |
Applying solder to high density substrates |
Eric P. Dibble, Steven L. Hanakovic, Voya R. Markovich, Daniel S. Niedrich, Gary Paul Vlasak +1 more |
1994-05-31 |
| 4820643 |
Process for determining the activity of a palladium-tin catalyst |
William J. Amelio, Kenneth R. Czarnecki, Gary K. Lemon, Voya R. Markovich, Carlos J. Sambucetti |
1989-04-11 |
