Issued Patents All Time
Showing 25 most recent of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424527 | Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages | Timothy L. Olson, Clifford Sandstrom | 2025-09-23 |
| 12424450 | Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same | Craig Bishop, Andrew Hoetker, Ryan Sanden, Timothy L. Olson | 2025-09-23 |
| 12362322 | Method of making a fan-out semiconductor assembly with an intermediate carrier | Timothy L. Olson | 2025-07-15 |
| 12300561 | Fully molded structure with multi-height components comprising backside conductive material and method for making the same | Clifford Sandstrom, Robin Davis, Timothy L. Olson | 2025-05-13 |
| 12259427 | Thermal head comprising a plurality of adapters for independent thermal control of zones | Thomas P. Jones, Samer Kabbani, Chan See Jean | 2025-03-25 |
| 12205881 | Semiconductor assembly comprising a 3D block and method of making the same | Timothy L. Olson, Craig Bishop, Robin Davis | 2025-01-21 |
| 12170261 | Molded direct contact interconnect structure without capture pads and method for the same | Robin Davis, Timothy L. Olson, Craig Bishop, Clifford Sandstrom | 2024-12-17 |
| 12062550 | Molded direct contact interconnect substrate and methods of making same | Robin Davis, Timothy L. Olson | 2024-08-13 |
| 11973051 | Molded direct contact interconnect structure without capture pads and method for the same | Robin Davis, Timothy L. Olson, Craig Bishop, Clifford Sandstrom | 2024-04-30 |
| 11828795 | Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones | Thomas P. Jones, Samer Kabbani, Chan See Jean | 2023-11-28 |
| 11796589 | Thermal head for independent control of zones | Thomas P. Jones, Samer Kabbani, Chan See Jean | 2023-10-24 |
| 11749534 | Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the same | Robin Davis, Clifford Sandstrom, Timothy L. Olson | 2023-09-05 |
| 11693051 | Thermal head for independent control of zones | Thomas P. Jones, Samer Kabbani, Chan See Jean | 2023-07-04 |
| 11656272 | Test system with a thermal head comprising a plurality of adapters and one or more cold plates for independent control of zones | Thomas P. Jones, Samer Kabbani, Chan See Jean | 2023-05-23 |
| 7176062 | Lead-frame method and assembly for interconnecting circuits within a circuit module | Jeffrey Alan Miks, Kenneth Kaskoun, Markus K. Liebhard, Donald C. Foster, Frederic Bertholio | 2007-02-13 |
| 7064009 | Thermally enhanced chip scale lead on chip semiconductor package and method of making same | David McCann, Richard L. Groover | 2006-06-20 |
| 7045883 | Thermally enhanced chip scale lead on chip semiconductor package and method of making same | David McCann, Richard L. Groover | 2006-05-16 |
| 6919631 | Structures for improving heat dissipation in stacked semiconductor packages | David Zoba | 2005-07-19 |
| 6900527 | Lead-frame method and assembly for interconnecting circuits within a circuit module | Jeffrey Alan Miks, Kenneth Kaskoun, Markus K. Liebhard, Donald C. Foster, Frederic Bertholio | 2005-05-31 |
| 6873032 | Thermally enhanced chip scale lead on chip semiconductor package and method of making same | David McCann, Richard L. Groover | 2005-03-29 |
| 6759266 | Quick sealing glass-lidded package fabrication method | — | 2004-07-06 |
| 6737750 | Structures for improving heat dissipation in stacked semiconductor packages | David Zoba | 2004-05-18 |
| 6707168 | Shielded semiconductor package with single-sided substrate and method for making the same | Doug Mathews | 2004-03-16 |
| 6632997 | Personalized circuit module package and method for packaging circuit modules | John Armando Miranda | 2003-10-14 |
| 6630661 | Sensor module with integrated discrete components mounted on a window | — | 2003-10-07 |