Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9851397 | Electromigration testing of interconnect analogues having bottom-connected sensory pins | Fen Chen, Cathryn J. Christiansen, Deborah M. Massey, Prakash Periasamy | 2017-12-26 |
| 9453873 | Non-planar field effect transistor test structure and lateral dielectric breakdown testing method | Fen Chen, Roger A. Dufresne, Kevin Kolvenbach | 2016-09-27 |
| 8754655 | Test structure, method and circuit for simultaneously testing time dependent dielectric breakdown and electromigration or stress migration | David G. Brochu, JR., Fen Chen, Roger A. Dufresne, Travis S. Merrill | 2014-06-17 |
| 8525153 | Structure including voltage controlled negative resistance | Fen Chen, Elbert E. Huang | 2013-09-03 |
| 7843062 | Thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature | Fen Chen, Cathryn J. Christiansen, Timothy D. Sullivan | 2010-11-30 |
| 7709401 | Method of making thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature | Fen Chen, Cathryn J. Christiansen, Timothy D. Sullivan | 2010-05-04 |