Issued Patents All Time
Showing 25 most recent of 109 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12386768 | Extending multichip package link off package | Debendra Das Sharma, Zuoguo Wu, Mohiuddin M. Mazumder, Venkatraman Iyer, Jeff C. Morriss | 2025-08-12 |
| 12373255 | Systems and methods for sharing memory across clusters of directly connected nodes | Alexander J. Branover, Francisco L. Duran, Vydhyanathan Kalyanasundharam | 2025-07-29 |
| 12222881 | Logical physical layer interface specification support for PCie 6.0, cxl 3.0, and UPI 3.0 protocols | Swadesh Choudhary, Debendra Das Sharma | 2025-02-11 |
| 12001353 | System, apparatus and method for synchronizing multiple virtual link states over a package interconnect | Joon Teik Hor, Ting Lok Song, Su Wei Lim | 2024-06-04 |
| 11971841 | Link layer-PHY interface adapter | Narasimha Lanka, Swadesh Choudhary, Lakshmipriya Seshan | 2024-04-30 |
| 11797378 | Multichip package link error detection | Venkatraman Iyer, Robert G. Blankenship, Zuoguo Wu | 2023-10-24 |
| 11729096 | Techniques to support multiple protocols between computer system interconnects | Debendra Das Sharma, Michelle C. Jen, Mark S. Myers, Don Soltis, Ramacharan Sundararaman +1 more | 2023-08-15 |
| 11726939 | Flex bus protocol negotiation and enabling sequence | Debendra Das Sharma, Michelle C. Jen, Prahladachar Jayaprakash Bharadwaj, Bruce A. Tennant | 2023-08-15 |
| 11663154 | Virtualized link states of multiple protocol layer package interconnects | Joon Teik Hor, Ting Lok Song, Su Wei Lim | 2023-05-30 |
| 11442876 | System, apparatus and method for synchronizing multiple virtual link states over a package interconnect | Joon Teik Hor, Ting Lok Song, Su Wei Lim | 2022-09-13 |
| 11386033 | Extending multichip package link off package | Debendra Das Sharma, Zuoguo Wu, Mohiuddin M. Mazumder, Venkatraman Iyer, Jeff C. Morriss | 2022-07-12 |
| 11308018 | Virtualized link states of multiple protocol layer package interconnects | Joon Teik Hor, Ting Lok Song, Su Wei Lim | 2022-04-19 |
| 11307928 | Multichip package link error detection | Venkatraman Iyer, Robert G. Blankenship, Zuoguo Wu | 2022-04-19 |
| 11245604 | Techniques to support multiple interconnect protocols for a common set of interconnect connectors | Mark S. Myers, Stephen R. Van Doren, Dimitrios Ziakas, Bassam N. Coury | 2022-02-08 |
| 11144492 | Flex bus protocol negotiation and enabling sequence | Debendra Das Sharma, Michelle C. Jen, Prahladachar Jayaprakash Bharadwaj, Bruce A. Tennant | 2021-10-12 |
| 11113225 | Extending multichip package link off package | Debendra Das Sharma, Zuoguo Wu, Mohiuddin M. Mazumder, Venkatraman Iyer, Jeff C. Morriss | 2021-09-07 |
| 11095556 | Techniques to support multiple protocols between computer system interconnects | Debendra Das Sharma, Michelle C. Jen, Mark S. Myers, Don Soltis, Ramacharan Sundararaman +1 more | 2021-08-17 |
| 11061761 | Multichip package link error detection | Venkatraman Iyer, Robert G. Blankenship, Zuoguo Wu | 2021-07-13 |
| 11003610 | Multichip package link | Zuoguo Wu, Debendra Das Sharma, Gerald Pasdast, Ananthan Ayyasamy, Xiaobel Li +2 more | 2021-05-11 |
| 10884195 | Techniques to support multiple interconnect protocols for a common set of interconnect connectors | Mark S. Myers, Stephen R. Van Doren, Dimitrios Ziakas, Bassam N. Coury | 2021-01-05 |
| 10860515 | Integrated input/output management | Swadesh Choudhary, Bahaa Fahim | 2020-12-08 |
| 10846258 | Voltage modulated control lane | Venkatraman Iyer, Zuoguo Wu | 2020-11-24 |
| 10776302 | Virtualized link states of multiple protocol layer package interconnects | Joon Teik Hor, Ting Lok Song, Su Wei Lim | 2020-09-15 |
| 10678736 | Extending multichip package link off package | Debendra Das Sharma, Zuoguo Wu, Mohiuddin M. Mazumder, Venkatraman Iyer, Jeff C. Morriss | 2020-06-09 |
| 10606785 | Flex bus protocol negotiation and enabling sequence | Debendra Das Sharma, Michelle C. Jen, Prahladachar Jayaprakash Bharadwaj, Bruce A. Tennant | 2020-03-31 |