Issued Patents All Time
Showing 25 most recent of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887970 | Stacked microfeature devices and associated methods | Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong | 2024-01-30 |
| 11373979 | Stacked microfeature devices and associated methods | Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong | 2022-06-28 |
| 10062667 | Stacked microfeature devices and associated methods | Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong | 2018-08-28 |
| 9515046 | Stacked microfeature devices and associated methods | Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong | 2016-12-06 |
| 9490220 | Redistribution structures for microfeature workpieces | — | 2016-11-08 |
| 9447497 | Processing chamber gas delivery system with hot-swappable ampoule | Dien-Yeh Wu, David Santi, Hyman Lam | 2016-09-20 |
| 9313902 | Conductive structures for microfeature devices and methods for fabricating microfeature devices | — | 2016-04-12 |
| 8946873 | Redistribution structures for microfeature workpieces | — | 2015-02-03 |
| 8491967 | In-situ chamber treatment and deposition process | Paul F. Ma, Joseph AuBuchon, Mei Chang, Steven H. Kim, Dien-Yeh Wu +2 more | 2013-07-23 |
| 8400780 | Stacked microfeature devices | Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong | 2013-03-19 |
| 8222727 | Conductive structures for microfeature devices and methods for fabricating microfeature devices | — | 2012-07-17 |
| 7923824 | Microelectronic component assemblies and microelectronic component lead frame structures | — | 2011-04-12 |
| 7742313 | Stacked microfeature devices | Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong | 2010-06-22 |
| 7655508 | Overmolding encapsulation process and encapsulated article made therefrom | Todd O. Bolken | 2010-02-02 |
| 7652365 | Microelectronic component assemblies and microelectronic component lead frame structures | — | 2010-01-26 |
| 7632747 | Conductive structures for microfeature devices and methods for fabricating microfeature devices | — | 2009-12-15 |
| 7608788 | Plating buss and a method of use thereof | — | 2009-10-27 |
| 7439450 | Plating buss and a method of use thereof | — | 2008-10-21 |
| 7296346 | Plating buss and a method of use thereof | — | 2007-11-20 |
| 7298025 | Microelectronic component assemblies and microelectronic component lead frame structures | — | 2007-11-20 |
| 7247520 | Microelectronic component assemblies and microelectronic component lead frame structures | — | 2007-07-24 |
| 7181837 | Plating buss and a method of use thereof | — | 2007-02-27 |
| 7151013 | Semiconductor package having exposed heat dissipating surface and method of fabrication | David J. Corisis, Mike Brooks, Larry D. Kinsman | 2006-12-19 |
| 7148974 | Method for tracking the location of mobile agents using stand-off detection technique | Randal L. Schmitt, Susan Fae Ann Bender, Philip J. Rodacy, Philip J. Hargis, Jr. | 2006-12-12 |
| 7132734 | Microelectronic component assemblies and microelectronic component lead frame structures | — | 2006-11-07 |