| 11955318 |
Ash rate recovery method in plasma strip chamber |
Yongkwan Kim, Changhun Lee, Chung Hoan Kim, Youngmin SHIN |
2024-04-09 |
| 11031233 |
High lateral to vertical ratio etch process for device manufacturing |
Sang-wook Kim, Daehee Weon, Sang-jun Choi, Sreekar Bhaviripudi, Jahyong Kuh |
2021-06-08 |
| 10460921 |
High lateral to vertical ratio etch process for device manufacturing |
Sang-wook Kim, Daehee Weon, Sang-jun Choi, Sreekar Bhaviripudi, Jahyong Kuh |
2019-10-29 |
| 8956500 |
Methods to eliminate “M-shape” etch rate profile in inductively coupled plasma reactor |
Stephen Yuen, Valentin N. Todorow, Tae Won Kim, Anisul Khan, Shashank Deshmukh |
2015-02-17 |
| 8529776 |
High lateral to vertical ratio etch process for device manufacturing |
Sang-wook Kim, Daehee Weon, Sang-jun Choi, Sreekar Bhaviripudi, Jahyong Kuh |
2013-09-10 |
| 7771606 |
Pulsed-plasma system with pulsed reaction gas replenish for etching semiconductors structures |
Tae Won Kim, Alexander Paterson, Valentin N. Todorow, Shashank Deshmukh |
2010-08-10 |
| 7754610 |
Process for etching tungsten silicide overlying polysilicon particularly in a flash memory |
Jinhan Choi, Bi Jang, Shashank Deshmukh, Meihua Shen, Thorsten Lill +1 more |
2010-07-13 |
| 7737042 |
Pulsed-plasma system for etching semiconductor structures |
Tae Won Kim, Alexander Paterson, Valentin N. Todorow, Shashank Deshmukh |
2010-06-15 |
| 7718538 |
Pulsed-plasma system with pulsed sample bias for etching semiconductor substrates |
Tae Won Kim, Alexander Paterson, Valentin Todorov, Shashank Deshmukh |
2010-05-18 |
| 7368392 |
Method of fabricating a gate structure of a field effect transistor having a metal-containing gate electrode |
Jinhan Choi, Shashank Deshmukh, Sang In Yi |
2008-05-06 |
