Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9851398 | Via leakage and breakdown testing | Fen Chen, Roger A. Dufresne, Charles W. Griffin | 2017-12-26 |
| 9453873 | Non-planar field effect transistor test structure and lateral dielectric breakdown testing method | Fen Chen, Roger A. Dufresne, Michael A. Shinosky | 2016-09-27 |
| 9153558 | Electromigration immune through-substrate vias | Ronald G. Filippi, John A. Fitzsimmons, Ping-Chuan Wang | 2015-10-06 |
| 8304863 | Electromigration immune through-substrate vias | Ronald G. Filippi, John A. Fitzsimmons, Ping-Chuan Wang | 2012-11-06 |
| 7805274 | Structure and methodology for characterizing device self-heating | Ping-Chuan Wang, Paul A. Hyde, Giuseppe La Rosa | 2010-09-28 |
| 7710141 | Method and apparatus for dynamic characterization of reliability wearout mechanisms | Giuseppe La Rosa, Ping-Chuan Wang, Stephen D. Wyatt | 2010-05-04 |
| 7375371 | Structure and method for thermally stressing or testing a semiconductor device | Giuseppe La Rosa, John G. Massey, Ping-Chuan Wang, Kai Xiu | 2008-05-20 |
| 6476632 | Ring oscillator design for MOSFET device reliability investigations and its use for in-line monitoring | Gluseppe La Rosa, Fernando Guarin, Stewart E. Rauch, III | 2002-11-05 |