Issued Patents All Time
Showing 25 most recent of 120 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12319564 | Semiconductor device and method of forming microelectromechanical systems (MEMS) package | Yaojian Lin, Won Kyoung Choi, Ivan Micallef | 2025-06-03 |
| 11569136 | Semiconductor device and method of forming dual-sided interconnect structures in FO-WLCSP | Yaojian Lin | 2023-01-31 |
| 11488838 | Semiconductor device having an embedded conductive layer for power/ground planes in Fo-eWLB | Yaojian Lin, Xu Sheng Bao | 2022-11-01 |
| 11370655 | Semiconductor device and method of forming microelectromechanical systems (MEMS) package | Yaojian Lin, Won Kyoung Choi, Ivan Micallef | 2022-06-28 |
| 11127666 | Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure | Yaojian Lin, Jianmin Fang | 2021-09-21 |
| 11024561 | Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units | Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu, Yu Gu | 2021-06-01 |
| 10790158 | Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern | Yaojian Lin, Hin Hwa Goh, Il Kwon Shim | 2020-09-29 |
| 10741416 | Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB | Yaojian Lin, Xu Sheng Bao | 2020-08-11 |
| 10707150 | Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units | Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu, Yu Gu | 2020-07-07 |
| 10662056 | Semiconductor device and method of forming microelectromechanical systems (MEMS) package | Yaojian Lin, Won Kyoung Choi, Ivan Micallef | 2020-05-26 |
| 10622293 | Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP) | Seung Wook Yoon, Jose Alvin Caparas, Yaojian Lin, Pandi C. Marimuthu, Xusheng Bao +1 more | 2020-04-14 |
| 10607946 | Semiconductor device and method of forming interconnect substrate for FO-WLCSP | Yaojian Lin, Jianmin Fang, Xia Feng | 2020-03-31 |
| 10475779 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Yaojian Lin, Seung Wook Yoon | 2019-11-12 |
| 10446479 | Semiconductor device and method of forming a PoP device with embedded vertical interconnect units | Pandi C. Marimuthu, Yaojian Lin, Yu Gu, Won Kyoung Choi | 2019-10-15 |
| 10304817 | Semiconductor device and method of forming build-up interconnect structures over a temporary substrate | Yaojian Lin | 2019-05-28 |
| 10297556 | Semiconductor device and method of controlling warpage in reconstituted wafer | Kian Meng Heng, Hin Hwa Goh, Jose Alvin Caparas, Seng Guan Chow, Yaojian Lin | 2019-05-21 |
| 10297518 | Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package | Yaojian Lin, Yu Gu | 2019-05-21 |
| 10217702 | Semiconductor device and method of forming an embedded SoP fan-out package | Yaojian Lin | 2019-02-26 |
| 10211183 | Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels | Yaojian Lin, Jianmin Fang, Haijing Cao | 2019-02-19 |
| 10204879 | Semiconductor device and method of forming wafer-level interconnect structures with advanced dielectric characteristics | Yaojian Lin | 2019-02-12 |
| 10204866 | Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation | Yaojian Lin, Jianmin Fang, Xia Feng | 2019-02-12 |
| 10189702 | Semiconductor device and method of forming microelectromechanical systems (MEMS) package | Yaojian Lin, Won Kyoung Choi, Ivan Micallef | 2019-01-29 |
| 10192801 | Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound | Yaojian Lin, Jianmin Fang, Haijing Cao | 2019-01-29 |
| 10192796 | Semiconductor device and method of forming dual-sided interconnect structures in FO-WLCSP | Yaojian Lin | 2019-01-29 |
| 10177010 | Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern | Yaojian Lin, Hin Hwa Goh, Il Kwon Shim | 2019-01-08 |