JG

Johann Greschner

IBM: 67 patents #1,125 of 70,183Top 2%
Applied Materials: 1 patents #4,780 of 7,310Top 70%
CG Carl Zeiss Smt Gmbh: 1 patents #657 of 1,189Top 60%
Overall (All Time): #31,282 of 4,157,543Top 1%
68
Patents All Time

Issued Patents All Time

Showing 25 most recent of 68 patents

Patent #TitleCo-InventorsDate
8039813 Charged particle-optical systems, methods and components Antonio Casares, Thomas Kemen, Rainer Knippelmeyer, Thomas Bayer, Georg Fritz +1 more 2011-10-18
6356089 Contact probe arrangement Thomas Bayer, Klaus Meissner, Werner Steiner, Roland Stoehr 2002-03-12
6218264 Method of producing a calibration standard for 2-D and 3-D profilometry in the sub-nanometer range Johann W. Bartha, Thomas Bayer, Martin Nonnenmacher, deceased, Helga Weiss 2001-04-17
6091124 Micromechanical sensor for AFM/STM profilometry Thomas Bayer, Helga Weiss 2000-07-18
6087199 Method for fabricating a very dense chip package H. Bernhard Pogge, Bijan Davari, Howard L. Kalter 2000-07-11
6088320 Micro-mechanically fabricated read/write head with a strengthening shell on the tip shaft Thomas Bayer, Helga Weiss 2000-07-11
6061074 Ion generator for ionographic print heads Johann W. Bartha, Frank Druschke, Gerhard Elsner 2000-05-09
6028008 Calibration standard for profilometers and manufacturing procedure Thomas Bayer, Klaus Meissner 2000-02-22
6004700 Membrane mask for electron beam lithography Samuel Kalt, Klaus Meissner, Rudolf Paul 1999-12-21
5998868 Very dense chip package H. Bernhard Pogge, Bijan Davari, Howard L. Kalter 1999-12-07
5960255 Calibration standard for 2-D and 3-D profilometry in the sub-nanometer range and method of producing it Johann W. Bartha, Thomas Bayer, Martin Nonnenmacher, deceased, Helga Weiss 1999-09-28
5939893 Contact probe arrangement for functional electrical testing Gerhard Elsner, Roland Stoehr 1999-08-17
5935739 Manufacturing method for membrane lithography mask with mask fields Thomas Bayer, Samuel Kalt, Klaus Meissner, Hans C. Pfeiffer 1999-08-10
5866443 Very dense integrated circuit package and method for forming the same H. Bernhard Pogge, Howard L. Kalter, Raymond J. Rosner 1999-02-02
5863636 Adhesive bond for densely ordered elements Frank Druschke, Gerhard Elsner, Roland Stoehr 1999-01-26
5817581 Process for the creation of a thermal SiO.sub.2 layer with extremely uniform layer thickness Thomas Bayer, Klaus Meissner 1998-10-06
5817201 Method of fabricating a field emission device Peter Pleshko, Gerhard Schmid 1998-10-06
5814885 Very dense integrated circuit package H. Bernhard Pogge, Howard L. Kalter 1998-09-29
5791959 Method of fabricating a field emission device Johann W. Bartha, Volkhard Wolf 1998-08-11
5789666 Resonant sensor for determining multiple physical values Thomas Bayer, Gerhard Schmid, Volker Wolf 1998-08-04
5783905 Field emission device with series resistor tip and method of manufacturing Peter Pleshko, Gerhard Schmid 1998-07-21
5770884 Very dense integrated circuit package H. Bernhard Pogge, Howard L. Kalter, Raymond J. Rosner 1998-06-23
5717278 Field emission device and method for fabricating it Johann W. Bartha, Volkhard Wolf 1998-02-10
5707537 Bulk removal, transport and storage fixture for small batch-fabricated devices Johann W. Bartha, Klaus Meissner, Volkhard Wolf 1998-01-13
5665905 Calibration standard for 2-D and 3-D profilometry in the sub-nanometer range and method of producing it Johann W. Bartha, Thomas Bayer, Martin Nonnenmacher, deceased, Helga Weiss 1997-09-09