Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798906 | Semiconductor chip | Jeong-gi Jin, Nae-In Lee, Jum-Yong Park, Seong Min Son, Ho-Jin Lee | 2023-10-24 |
| 11469202 | Semiconductor device | Seong Min Son, Jeong-gi Jin, Jin Ho An, Kwang-Jin Moon, Ho-Jin Lee | 2022-10-11 |
| 11251144 | Semiconductor chip | Jeong-gi Jin, Nae-In Lee, Jum-Yong Park, Seong Min Son, Ho-Jin Lee | 2022-02-15 |
| 10833032 | Semiconductor device | Seong Min Son, Jeong-gi Jin, Jin Ho An, Kwang-Jin Moon, Ho-Jin Lee | 2020-11-10 |
| 10580726 | Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devices | Seong Min Son, Hyung Jun Jeon, Kwang-Jin Moon, Jin Ho An, Ho-Jin Lee +1 more | 2020-03-03 |
| 10483224 | Semiconductor chip | Jeong-gi Jin, Nae-In Lee, Jum-Yong Park, Seong Min Son, Ho-Jin Lee | 2019-11-19 |
| 9698051 | Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages | Byung-Iyul Park, Hyun-Soo Chung, Gil-Heyun Choi, Son-Kwan Hwang | 2017-07-04 |
| 9691685 | Semiconductor devices and methods of manufacturing the same, and semiconductor packages including the semiconductor devices | Kyu-Ha Lee, Hyung Jun Jeon, Jum-Yong Park, Byung-Lyul Park, Ji-Soon Park +1 more | 2017-06-27 |
| 9520361 | Semiconductor devices | Pil-Kyu Kang, Seok Ho Kim, Tae-Yeong Kim, Hyo Ju Kim, Byung-Lyul Park +1 more | 2016-12-13 |
| 9461007 | Wafer-to-wafer bonding structure | Pil-Kyu Kang, Byung-Lyul Park, Jae-Hwa Park, Ju-Il Choi | 2016-10-04 |
| 8957526 | Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages | Byung-Lyul Park, Hyun-Soo Chung, Gil-Heyun Choi, Son-Kwan Hwang | 2015-02-17 |
| 8735281 | Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same | Chang-Woo Shin, Hyun-Soo Chung, Eun-Chul Ahn, Jum-Gon Kim | 2014-05-27 |
| 8456012 | Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same | Chang-Woo Shin, Hyun-Soo Chung, Eun-Chul Ahn, Jum-Gon Kim | 2013-06-04 |