Issued Patents All Time
Showing 26–50 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381261 | Method of manufacturing high resistivity semiconductor-on-insulator wafers with charge trapping layers | Igor Peidous, Srikanth Kommu, Andrew M. Jones, Samuel Christopher Pratt, Horacio Josue Mendez +2 more | 2019-08-13 |
| 10381260 | Method of manufacturing high resistivity semiconductor-on-insulator wafers with charge trapping layers | Igor Peidous, Srikanth Kommu, Andrew M. Jones, Samuel Christopher Pratt, Horacio Josue Mendez +2 more | 2019-08-13 |
| 10283402 | Method of depositing charge trapping polycrystalline silicon films on silicon substrates with controllable film stress | Gang Wang, Shawn George Thomas, Igor Peidous | 2019-05-07 |
| 10269617 | High resistivity silicon-on-insulator substrate comprising an isolation region | Igor Peidous | 2019-04-23 |
| 10068795 | Methods for preparing layered semiconductor structures | Michael J. Ries, Charles R. Lottes | 2018-09-04 |
| 9925755 | Clamping apparatus for cleaving a bonded wafer structure and methods for cleaving | Gregory Young | 2018-03-27 |
| 9831115 | Process flow for manufacturing semiconductor on insulator structures in parallel | Igor Peidous, Andrew M. Jones, Srikanth Kommu | 2017-11-28 |
| 9343379 | Method to delineate crystal related defects | Lu Fei | 2016-05-17 |
| 9281233 | Method for low temperature layer transfer in the preparation of multilayer semiconductor devices | Michael J. Ries | 2016-03-08 |
| 9209069 | Method of manufacturing high resistivity SOI substrate with reduced interface conductivity | Shilpi Vaypayee | 2015-12-08 |
| 9202711 | Semiconductor-on-insulator wafer manufacturing method for reducing light point defects and surface roughness | Qingmin Liu | 2015-12-01 |
| 9165802 | Methods for cleaving a bonded wafer structure | Gregory Young | 2015-10-20 |
| 9159596 | Clamping apparatus for cleaving a bonded wafer structure | Gregory Young | 2015-10-13 |
| 8853054 | Method of manufacturing silicon-on-insulator wafers | Guoqiang Zhang | 2014-10-07 |
| 8845859 | Systems and methods for cleaving a bonded wafer pair | Michael J. Ries, Dale A. Witte | 2014-09-30 |
| 8846493 | Methods for producing silicon on insulator structures having high resistivity regions in the handle wafer | Lu Fei, Robert W. Standley | 2014-09-30 |
| 8822242 | Methods for monitoring the amount of metal contamination in a process | Lu Fei | 2014-09-02 |
| 8367519 | Method for the preparation of a multi-layered crystalline structure | Dale A. Witte | 2013-02-05 |
| 8143078 | Methods for monitoring the amount of contamination imparted into semiconductor wafers during wafer processing | Lu Fei | 2012-03-27 |
| 7217320 | Low defect density silicon having a vacancy-dominated core substantially free of oxidation induced stacking faults | Chang-Bum Kim, Steven L. Kimbel, Mohsen Banan | 2007-05-15 |
| 7201800 | Process for making silicon wafers with stabilized oxygen precipitate nucleation centers | Luciano Mule'Stagno, Richard J. Phillips, Milind Kulkarni, Mohsen Banan, Stephen J. Brunkhorst | 2007-04-10 |
| 7135351 | Method for controlling of thermal donor formation in high resistivity CZ silicon | Martin Jeffrey Binns, Robert J. Falster | 2006-11-14 |
| 7071080 | Process for producing silicon on insulator structure having intrinsic gettering by ion implantation | Robert J. Falster | 2006-07-04 |
| 6930375 | Silicon on insulator structure having an epitaxial layer and intrinsic gettering | Robert J. Falster | 2005-08-16 |
| 6897084 | Control of oxygen precipitate formation in high resistivity CZ silicon | Martin Jeffrey Binns, Robert J. Falster | 2005-05-24 |