Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8778776 | Methods of forming a semiconductor package using a seed layer and semiconductor packages formed using the same | Ju-Il Choi, Kyu-Ha Lee, Jung-Hwan Kim, Tae Hong Min | 2014-07-15 |
| 8637989 | Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodes | Ho-Jin Lee, Hyun-Soo Chung, Chang-Seong Jeon, Sang-Sick Park | 2014-01-28 |
| 8586477 | Semiconductor apparatus, method of manufacturing the same, and method of manufacturing semiconductor package | Se-Young Jeong, Ho-Jin Lee, Ho-Geon Song | 2013-11-19 |
| 8575760 | Semiconductor devices having electrodes | Uihyouong Lee, Ju-Il Choi, Jung-Hwan Kim | 2013-11-05 |
| 8564102 | Semiconductor device having through silicon via (TSV) | Ju-Il Choi, Kyu-Ha Lee, Ho-Jin Lee, Son-Kwan Hwang | 2013-10-22 |
| 8492902 | Multi-layer TSV insulation and methods of fabricating the same | Ho-Jin Lee, SeYoung Jeong, Jung-Hwan Kim, Tae Hong Min | 2013-07-23 |
| 8129840 | Semiconductor package and methods of manufacturing the same | Chajea Jo, Uihyoung Lee, Jeong Woo Park, Ha Young Yim | 2012-03-06 |