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Semiconductor device with through-mold via |
Dong Joo Park, Jin Seong Kim, Ki Wook Lee, Dae Byoung Kang, Ho Choi +3 more |
2024-01-09 |
| D979624 |
Industrial robot |
Sung-Jin Kwon, Kang-Wook Lee, Kang Gyun Kim |
2023-02-28 |
| 10811341 |
Semiconductor device with through-mold via |
Dong Joo Park, Jin Seong Kim, Ki Wook Lee, Dae Byoung Kang, Ho Choi +3 more |
2020-10-20 |
| 9839898 |
Fuel processor |
Dal Ryung Park, Bong Gyu KIM, Jin Wook Kim, Keun Yong Cho, Chul Hee Jeon +2 more |
2017-12-12 |
| 8847372 |
Exposed die overmolded flip chip package and fabrication method |
Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Dae Keun Park, Ki Wook Lee +1 more |
2014-09-30 |
| 8796561 |
Fan out build up substrate stackable package and method |
Christopher M. Scanlan, Roger D. St. Amand |
2014-08-05 |
| 8541260 |
Exposed die overmolded flip chip package and fabrication method |
Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Dae Keun Park, Ki Wook Lee +1 more |
2013-09-24 |
| 8476748 |
Exposed die overmolded flip chip package and fabrication method |
Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Dae Keun Park, Ki Wook Lee +1 more |
2013-07-02 |
| 8368194 |
Exposed die overmolded flip chip package |
Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Dae Keun Park, Ki Wook Lee +1 more |
2013-02-05 |
| 8207022 |
Exposed die overmolded flip chip package method |
Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Dae Keun Park, Ki Wook Lee +1 more |
2012-06-26 |
| 8089148 |
Circuit board and semiconductor device having the same |
Jun Su Lee, Min Jae Lee, Jae Jin Lee, Min Yoo, Byung-jun Kim |
2012-01-03 |
| 7982298 |
Package in package semiconductor device |
Dae Byoung Kang, Sung Jin Yang, Jung Tae Ok |
2011-07-19 |
| 7898093 |
Exposed die overmolded flip chip package and fabrication method |
Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Dae Keun Park, Ki Wook Lee +1 more |
2011-03-01 |
| 7872341 |
Semiconductor device |
Sang Jae Jang, Ki Wook Lee |
2011-01-18 |
| 7719845 |
Chamfered memory card module and method of making same |
Sang Jae Jang, Chul-Woo Park, Choon Heung Lee |
2010-05-18 |
| 7359204 |
Multiple cover memory card |
Sang Jae Jang, Chul-Woo Park, Jong Woon Choi, Choon Heung Lee, Chang Deok Lee |
2008-04-15 |
| 6803254 |
Wire bonding method for a semiconductor package |
Young-Kuk Park, Byung Joon Han |
2004-10-12 |
| 6642610 |
Wire bonding method and semiconductor package manufactured using the same |
Young-Kuk Park, Byung Joon Han |
2003-11-04 |
| 6253346 |
Data transmission circuit having cyclic redundancy check circuit and data rate control circuit |
Si Joong Kim, Jong Seog Koh |
2001-06-26 |