Issued Patents All Time
Showing 25 most recent of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11967576 | Systems for thermally treating conductive elements on semiconductor and wafer structures | — | 2024-04-23 |
| 11776877 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi +1 more | 2023-10-03 |
| 11679656 | Electric drive unit and drive axle system | Arash Atqiaee, Dan S. Ursu | 2023-06-20 |
| 11679657 | Electric drive unit and drive axle system | Arash Atqiaee, Dan S. Ursu | 2023-06-20 |
| 11139258 | Bonding pads with thermal pathways | Jaspreet S. Gandhi, Sameer S. Vadhavkar, Jian Li | 2021-10-05 |
| 11081458 | Methods and apparatuses for reflowing conductive elements of semiconductor devices | — | 2021-08-03 |
| 10861765 | Carrier removal by use of multilayer foil | Andrew M. Bayless, Xiao Li | 2020-12-08 |
| 10748878 | Semiconductor device assembly with heat transfer structure formed from semiconductor material | Sameer S. Vadhavkar, Jaspreet S. Gandhi | 2020-08-18 |
| 10580746 | Bonding pads with thermal pathways | Jaspreet S. Gandhi, Sameer S. Vadhavkar, Jian Li | 2020-03-03 |
| 10573612 | Bonding pads with thermal pathways | Jaspreet S. Gandhi, Sameer S. Vadhavkar, Jian Li | 2020-02-25 |
| 10559495 | Methods for processing semiconductor dice and fabricating assemblies incorporating same | Andrew M. Bayless, Xiao Li | 2020-02-11 |
| 10559551 | Semiconductor device assembly with heat transfer structure formed from semiconductor material | Sameer S. Vadhavkar, Jaspreet S. Gandhi | 2020-02-11 |
| 10481200 | Semiconductor device test apparatuses comprising at least one test site having an array of pockets | Jaspreet S. Gandhi, Michel Koopmans | 2019-11-19 |
| 10431519 | Carrier removal by use of multilayer foil | Andrew M. Bayless, Xiao Li | 2019-10-01 |
| 10297577 | Semiconductor device assembly with heat transfer structure formed from semiconductor material | Sameer S. Vadhavkar, Jaspreet S. Gandhi | 2019-05-21 |
| 10163830 | Bonding pads with thermal pathways | Jaspreet S. Gandhi, Sameer S. Vadhavkar, Jian Li | 2018-12-25 |
| 10163755 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi +1 more | 2018-12-25 |
| 10163693 | Methods for processing semiconductor dice and fabricating assemblies incorporating same | Andrew M. Bayless, Xiao Li | 2018-12-25 |
| 10126357 | Methods of testing semiconductor devices comprising a die stack having protruding conductive elements | Jaspreet S. Gandhi, Michel Koopmans | 2018-11-13 |
| 10043688 | Method for mount tape die release system for thin die ejection | Jeremy E. Minnich, Brandon P. Wirz, Bret K. Street | 2018-08-07 |
| 9837396 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi +1 more | 2017-12-05 |
| 9837383 | Interconnect structure with improved conductive properties and associated systems and methods | Jaspreet S. Gandhi, Wayne H. Huang | 2017-12-05 |
| 9768149 | Semiconductor device assembly with heat transfer structure formed from semiconductor material | Sameer S. Vadhavkar, Jaspreet S. Gandhi | 2017-09-19 |
| 9733304 | Semiconductor device test apparatuses | Jaspreet S. Gandhi, Michel Koopmans | 2017-08-15 |
| 9691746 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi +1 more | 2017-06-27 |