Issued Patents All Time
Showing 1–25 of 114 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394728 | Method of forming a region shielding within a package of a microelectronic device | Patrick Variot | 2025-08-19 |
| 12143077 | Power amplifier modules including semiconductor resistor and tantalum nitride terminated through wafer via | Peter J. Zampardi, Jr., Hongxiao Shao, Tin Myint Ko, Matthew Thomas Ozalas, Mehran Janani +4 more | 2024-11-12 |
| 12040284 | 3D-interconnect with electromagnetic interference (“EMI”) shield and/or antenna | Patrick Variot | 2024-07-16 |
| 12021041 | Region shielding within a package of a microelectronic device | Patrick Variot | 2024-06-25 |
| 11999888 | Method for in-situ modification of mercury quantum dots in traditional thermal injection process | Jingjing Liu, Jianlu Wang, Tianle Guo, Xinning Huang, Xiangjian Meng +2 more | 2024-06-04 |
| 11784265 | Mercury cadmium telluride-black phosphorous van der waals heterojunction infrared polarization detector and preparation method thereof | Xudong Wang, Hanxue Jiao, Yan-Jou Chen, Jianlu Wang, Xiangjian Meng +2 more | 2023-10-10 |
| 11335669 | Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias | Jiro Yota, Viswanathan Ramanathan | 2022-05-17 |
| 11302616 | Integrated interposer solutions for 2D and 3D IC packaging | Charles G. Woychik, Arkalgud R. Sitaram, Guilian Gao | 2022-04-12 |
| 11247154 | Truncated filter capsule | ZhenWu Lin, Stephan Brinke-Seiferth | 2022-02-15 |
| 11205600 | Integrated circuits protected by substrates with cavities, and methods of manufacture | Charles G. Woychik, Sitaram Arkalgud | 2021-12-21 |
| 11114408 | System and method for providing 3D wafer assembly with known-good-dies | Liang Wang, Guilian Gao | 2021-09-07 |
| 11100971 | Ferroelectric domain regulated optical readout mode memory and preparing method thereof | Jianlu Wang, Guangjian Wu, Xudong Wang, Tie Lin, Xiangjian Meng +1 more | 2021-08-24 |
| 11101160 | Device packaging using a recyclable carrier substrate | Jiro Yota, Viswanathan Ramanathan | 2021-08-24 |
| 11056390 | Structures and methods for reliable packages | Cyprian Emeka Uzoh, Guilian Gao, Liang Wang, Arkalgud R. Sitaram | 2021-07-06 |
| 10957811 | Ultra-broad spectrum detector integrated with functions of two-dimensional semiconductor and ferroelectric material | Jianlu Wang, Xudong Wang, Tie Lin, Xiangjian Meng, Junhao Chu | 2021-03-23 |
| 10849240 | Contact structures with porous networks for solder connections, and methods of fabricating same | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh | 2020-11-24 |
| 10653980 | Connection-free filter capsule apparatus | ZhenWu Lin | 2020-05-19 |
| 10629468 | Device packaging using a recyclable carrier substrate | Jiro Yota, Viswanathan Ramanathan | 2020-04-21 |
| 10623710 | HD color imaging using monochromatic CMOS image sensors integrated in 3D package | Liang Wang, Guilian Gao, Arkalgud R. Sitaram | 2020-04-14 |
| 10586759 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Liang Wang, Gabriel Z. Guevara, Rajesh Katkar, Cyprian Emeka Uzoh, Laura Wills Mirkarimi | 2020-03-10 |
| 10535564 | Structures and methods for reliable packages | Cyprian Emeka Uzoh, Guilian Gao, Liang Wang, Arkalgud R. Sitaram | 2020-01-14 |
| 10531574 | Contact structures with porous networks for solder connections, and methods of fabricating same | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh | 2020-01-07 |
| 10522457 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Zhuowen Sun, Liang Wang +1 more | 2019-12-31 |
| 10515926 | System and method for providing 3D wafer assembly with known-good-dies | Liang Wang, Guilian Gao | 2019-12-24 |
| 10490520 | Multichip modules and methods of fabrication | Liang Wang, Rajesh Katkar | 2019-11-26 |