Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12143077 | Power amplifier modules including semiconductor resistor and tantalum nitride terminated through wafer via | Peter J. Zampardi, Jr., Tin Myint Ko, Matthew Thomas Ozalas, Hong Shen, Mehran Janani +4 more | 2024-11-12 |
| 11451199 | Power amplifier systems with control interface and bias circuit | David Steven Ripley, Philip John Lehtola, Peter J. Zampardi, Jr., Tin Myint Ko, Matthew Thomas Ozalas | 2022-09-20 |
| 10771024 | Power amplifier modules including transistor with grading and semiconductor resistor | Peter J. Zampardi, Jr., Tin Myint Ko, Matthew Thomas Ozalas, David Steven Ripley, Philip John Lehtola | 2020-09-08 |
| 10128558 | Directional couplers and devices including same | Weimin Sun, Xiaofang Mu | 2018-11-13 |
| 10116274 | Process-compensated HBT power amplifier bias circuits and methods | David Steven Ripley, Philip John Lehtola, Peter J. Zampardi, Jr., Tin Myint Ko, Matthew Thomas Ozalas | 2018-10-30 |
| 10090812 | Power amplifier modules with bonding pads and related systems, devices, and methods | Hardik Bhupendra Modi, Sandra Louise Petty-Weeks, Weimin Sun, Peter J. Zampardi, Jr., Guohao Zhang | 2018-10-02 |
| 9859231 | Radio frequency integrated circuit module | Weimin Sun, Peter J. Zampardi, Jr. | 2018-01-02 |
| 9847755 | Power amplifier modules with harmonic termination circuit and related systems, devices, and methods | Weimin Sun, Peter J. Zampardi, Jr., Guohao Zhang, Hardik Bhupendra Modi, Dinhphuoc Vu Hoang | 2017-12-19 |
| 9748627 | Devices and methods related to directional couplers | Weimin Sun, Xiaofang Mu | 2017-08-29 |
| 9660584 | Power amplifier modules including wire bond pad and related systems, devices, and methods | Hardik Bhupendra Modi, Sandra Louise Petty-Weeks, Weimin Sun, Peter J. Zampardi, Jr., Guohao Zhang | 2017-05-23 |
| 9520835 | Power amplifier modules including bipolar transistor with grading and related systems, devices, and methods | Tin Myint Ko, Philip John Lehtola, Matthew Thomas Ozalas, David Steven Ripley, Peter J. Zampardi, Jr. | 2016-12-13 |
| 9472514 | Methods to fabricate a radio frequency integrated circuit | Weimin Sun, Peter J. Zampardi, Jr. | 2016-10-18 |
| 9419567 | Process-compensated HBT power amplifier bias circuits and methods | David Steven Ripley, Philip John Lehtola, Peter J. Zampardi, Jr., Tin Myint Ko, Matthew Thomas Ozalas | 2016-08-16 |
| 9287226 | Apparatus and methods for reducing impact of high RF loss plating | Weimin Sun, Peter J. Zampardi, Jr. | 2016-03-15 |
| 9041472 | Power amplifier modules including related systems, devices, and methods | Howard E. Chen, Yifan Guo, Dinhphuoc Vu Hoang, Mehran Janani, Tin Myint Ko +15 more | 2015-05-26 |
| 8896091 | Apparatus and methods for reducing impact of high RF loss plating | Weimin Sun, Peter J. Zampardi, Jr. | 2014-11-25 |
| 8889995 | Wire bond pad system and method | Weimin Sun, Peter J. Zampardi, Jr. | 2014-11-18 |
| 8686537 | Apparatus and methods for reducing impact of high RF loss plating | Weimin Sun, Peter J. Zampardi, Jr. | 2014-04-01 |