| 7825495 |
Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package |
Seung-Kwan Ryu, Sung-Min Sim, Dong-Hyeon Jang |
2010-11-02 |
| 7485006 |
Memory module, socket and mounting method providing improved heat dissipating characteristics |
Sang Wook Park, Joong-Hyun Baek, Hae-Hyung Lee, Jin-Yang Lee |
2009-02-03 |
| 7170158 |
Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture |
Cheol-Joon Yoo |
2007-01-30 |
| 7098407 |
Non-solder mask defined (NSMD) type wiring substrate for ball grid array (BGA) package and method for manufacturing such a wiring substrate |
Jin Ho Kim, In-Ku Kang |
2006-08-29 |
| 7030489 |
Multi-chip module having bonding wires and method of fabricating the same |
In-Ku Kang, Sang-Ho An, Sang-Yeop Lee |
2006-04-18 |
| 6386432 |
Semiconductor die pickup method that prevents electrostatic discharge |
Ho Jin |
2002-05-14 |
| 6348363 |
Method for manufacturing a semiconductor package |
Myung-Kee Chung, San Yeop Lee |
2002-02-19 |
| 6321971 |
Die collet for a semiconductor chip and apparatus for bonding semiconductor chip to a lead frame |
Ho Jin |
2001-11-27 |
| 5979739 |
Semiconductor die bonding apparatus having multiple bonding system |
Ho Jin, Jae Ky Roh, Sung-Bok Hong |
1999-11-09 |
| 5886405 |
Semiconductor device package having inner leads with slots |
Tae Hyeong Kim, Tae-Sung Park, In Sik Cho |
1999-03-23 |
| 5811132 |
Mold for semiconductor packages |
Hee Sun Rho, In Sik Cho, Tae-Sung Park |
1998-09-22 |
| 5765277 |
Die bonding apparatus with a revolving pick-up tool |
Ho Jin, Sung-Bok Hong, Jae Ky Roh |
1998-06-16 |
