Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081374 | Semiconductor package molding device and method of manufacturing semiconductor device | Hee-Ju Seo, Jae Won Choi, Young Jin Hwang | 2021-08-03 |
| 11011395 | Cover structure for a light source, light illuminating apparatus having the same | Young Sik Kim, Young-Hong Han, Young-Gon Hwang | 2021-05-18 |
| 8905290 | Apparatus for mounting semiconductor chips on a circuit board | Il-Soo Choi, Min-Ill Kim, Tae-Ho Moon, Ju-Young Yu | 2014-12-09 |
| 8672210 | Capillary exchange system of semiconductor wire bonding | Young Sik Kim, Doo Jin Kim, Ki-Taik Oh | 2014-03-18 |
| 7074646 | In-line die attaching and curing apparatus for a multi-chip package | Hyun-Ho Kim, Young-Kyun Sun, Kyoung-Bok Cho | 2006-07-11 |
| 6863109 | In-line die attaching and curing apparatus for a multi-chip package | Hyun-Ho Kim, Young-Kyun Sun, Kyoung-Bok Cho | 2005-03-08 |
| 6187121 | Die-bonding equipment and a method for detecting residual adhesive material using the same | Yong Choul Lee, Yong-Dae Ha, Young-Gon Hwang | 2001-02-13 |
| 5979739 | Semiconductor die bonding apparatus having multiple bonding system | Ho Jin, Jae Ky Roh, Hee-Kook Choi | 1999-11-09 |
| 5765277 | Die bonding apparatus with a revolving pick-up tool | Ho Jin, Jae Ky Roh, Hee-Kook Choi | 1998-06-16 |