Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8672210 | Capillary exchange system of semiconductor wire bonding | Young Sik Kim, Doo Jin Kim, Sung-Bok Hong | 2014-03-18 |
| 7841505 | Wire clamp and wire bonding apparatus having the same | Sung-Soo Lee, Jung-Hyeon Kim | 2010-11-30 |