Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482505 | Chip bonding apparatus | Jae-cheol KIM, Gil Man Kang | 2022-10-25 |
| 10692833 | Apparatus for correcting a parallelism between a bonding head and a stage, and a chip bonder including the same | Jae-cheol KIM, Gil Man Kang, Kyoung-Bok Cho | 2020-06-23 |
| 10330722 | Pipe structure and semiconductor module testing equipment including the same | Min Woo KIM, Chang-Ho Lee, Seul Ki Han | 2019-06-25 |
| 9324661 | Semiconductor package and method of manufacturing the same | Doo Jin Kim, Young Sik Kim, Tea-Seog Um | 2016-04-26 |
| 8042593 | Semiconductor chip bonding apparatus | Cheal-Sang Yoon, Jae-Ryoung Lee, Jeong-Soon Cho, Bum Woo Lee, Pil-June Kim | 2011-10-25 |
| 6187121 | Die-bonding equipment and a method for detecting residual adhesive material using the same | Sung-Bok Hong, Yong Choul Lee, Young-Gon Hwang | 2001-02-13 |