Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482505 | Chip bonding apparatus | Jae-cheol KIM, Yong-Dae Ha | 2022-10-25 |
| 10692833 | Apparatus for correcting a parallelism between a bonding head and a stage, and a chip bonder including the same | Jae-cheol KIM, Kyoung-Bok Cho, Yong-Dae Ha | 2020-06-23 |