Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10692833 | Apparatus for correcting a parallelism between a bonding head and a stage, and a chip bonder including the same | Jae-cheol KIM, Gil Man Kang, Yong-Dae Ha | 2020-06-23 |
| 10016833 | Solder ball mounter | Seok-Yong Lee, Yo-Se Eum, Tea-Seog Um, Jeong Jin Lee | 2018-07-10 |
| 7074646 | In-line die attaching and curing apparatus for a multi-chip package | Hyun-Ho Kim, Young-Kyun Sun, Sung-Bok Hong | 2006-07-11 |
| 6863109 | In-line die attaching and curing apparatus for a multi-chip package | Hyun-Ho Kim, Young-Kyun Sun, Sung-Bok Hong | 2005-03-08 |