Patents per Year
Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018038 | Apparatus for sawing a semiconductor package | Yong-Ki Kim | 2021-05-25 |
| 10016833 | Solder ball mounter | Seok-Yong Lee, Tea-Seog Um, Kyoung-Bok Cho, Jeong Jin Lee | 2018-07-10 |
| 9113585 | Method of forming external terminals of a package and apparatus for performing the same | Sang-Geun Kim, Seok-Yong Lee | 2015-08-18 |
| 8132305 | Equipment and method for cutting package | Tai-Kew Choi, Yong-Kyun Sun, Hee-Sang Yang, Ho-Soo Jang | 2012-03-13 |